DA 90 Series

Press Release
DA 90 Low Temperature Die Attach Adhesive Series Materials
(Albany, NY) June 20, 2017 – The DA 90 series materials are YINCAE’s new low temperature die attach adhesives. The DA 90 series offers conductive and insulating options to suit a large variety of applications. These products can be cured at low temperatures (82 – 90°C) and can be used for high temperature applications (215°C for 15 years). In addition to low temperature curing, these products also offer no delamination, high reliability, and high thermal and electrical conductivity. DA 90 series die attach adhesive materials are commercially available and are currently being used for insulating and conductive die attach applications. Additional information regarding DA 90 products is available by contacting YINCAE at info@yincae.com. If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.
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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

SEMICON West 2017

Press Release

YINCAE to Exhibit

SEMICON West Booth 5248 North Hall

 

(Albany, NY) 13 June 2017 – The SEMICON West 2017, North America’s premier Microelectronics event is less than a month away! SEMICON West 2017 will be held at the Moscone Center in San Francisco, CA from July 11th to 13th. YINCAE is pleased to exhibit in the NORTH HALL at booth 5248 where YINCAE is featuring two materials: SMT 256EP and BP 256.

BP 256 is YINCAE’s new ball attach adhesive product. BP 256 has been designed to enhance solder joint reliability and eliminate cleaning processes for LEAD-FREE ball bumping procedures on CSP, BGA, Flip chip, and PoP devices and is compatible with current SMT assembly processes. Also featured is SMT 256EP which replaces traditional solder paste, flux, and underfill. SMT 256EP enhances solder joint strength by 5 to 10 times and has demonstrated high pull strength at both room and high temperatures (280°C). At 280°C, SMT 256EP has a pull strength up to 180g. Thus, SMT 256EP eliminates the RTV or red glue that is typically used to hold components during double reflow, and reduces manufacturing costs.

YINCAE offers a variety of exclusive Adhesives, Thermal Interface, and Chip/Board/Packaging level materials that have been adopted by leading contract manufacturers and Tier 1 Microelectronic suppliers. Recipient of the 2015 Global Technology Award; YINCAE innovated the WORLD’s FIRST Lead-Free Solder Joint Encapsulation Adhesive solutions for wafer level, flip chip, POP, LGA, BGA and many more applications. YINCAE offers SJEA for low, medium, and high temperature solder alloy applications for your individualized needs.

If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit the company website by clicking the following link: YINCAE Website.

 

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.
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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC

Coming Soon: FAQ Page

YINCAE FAQ Title

Frequently asked questions (FAQ) or Questions and Answers (Q&A), are listed questions and answers provided by our Technical Support team. The goal of creating a FAQ page is to ensure proper handling and usage of YINCAE materials.

Please be sure to check our new FAQ Page atwww.yincae.com for more information on common questions and concerns.

Have questions that are not listed? We would love to hear from you! Please email questions to info@yincae.com.

 

 

SMT 138 Dispense Test

Example of consistent dispense flow of YINCAE material: SMT 138

SMT 138 series include: SMT 138E, SMT 138P, and SMT 138T

SMT 138 series solderable conductive adhesives are rapid cure, self-leveling and self-soldering adhesives, which have been designed for low temperature (138◦C) Pb-free applications. By comparison with conductive adhesives (Ag), SMT 138 series solderable adhesives have higher stable electrical and thermal conductivity, outstanding reliability, and easily rework. By comparison with soldering materials, SMT 138 series solderable adhesives eliminate the out gassing from soldering process, flux residue issue and soldering bleed. During the reflow process, Solder joint encapsulant adhesives removes metal oxide and encapsulates individual solder joints with enhancing solder joint to eliminate some drawbacks of underfilling (large CTE above Tg, trouble process control). The performance of drop test has been improved by two orders of magnitude compared with that with the use of solder paste. The polymer network can be removed using methyl ethyl ketone (MEK) or heating.

We’re Going Places…

 

We are pleased to confirm that we will be exhibiting at SEMICON West in San Francisco, California on July 11th through the 13th. You will find our booth positioned in the NORTH HALL of the Moscone Center.

This year we will reside at booth # 5248. Feel free to stop by and say hi. Dr. Yin and our team have a wealth of knowledge in the SMT industry and would love to converse with you!

YINCAE Advanced Materials is a manufacturer of proprietary high performance adhesives, encapsulants and coatings for the electronics industry. Our products are focused on the central processor unit (CPU), providing new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices.

YINCAE adhesive products include: encapsulant, superfast cure adhesives for underfill replacement, solder joint encapsulant with eliminating underfilling process, solderable adhesives with high thermal and electrical conductivity for high power devices, optical adhesives for LCD, optoelectrical application, reactive thermal grease and thermal conductive adhesives.

 

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