FAQ – Solder Joint Encapsulants

bp256

What are solder joint encapsulant adhesives?

YINCAE solder joint encapsulant adhesives are epoxy based materials with a built-in flux function.

During reflow, solder joint encapsulant adhesives remove oxides allowing the solder joint to form, and encapsulate the solder joint in a 3D polymer network.

 

What are the benefits of solder joint encapsulant adhesives?

  1. Enhance solder joint strength
  2. Improve device reliability
  3. Eliminate underfill and the underfilling process
  4. Eliminate electrical issues (dendrites, electro-migration…)
  5. Eliminates cleaning processes
  6. Lower costs

 

How can solder joint encapsulant adhesives lower costs?

  1. 100 % reworkable – eliminate scrap cost
  2. Air reflowable – eliminate nitrogen cost
  3. Lower material usage
  4. Short manufacturing process – See comparison below
  5. High process yield

 

Underfill Process

underfill process

 

Solder Joint Encapsulant Process

SJE Process

 

 

Why is the reliability for solder joint encapsulant adhesives better than underfills?

Eliminate shrinkage factor generated by underfill (gap is filled with air when using solder joint encapsulants) – Less stress improves reliability

 

 

Can solder joint encapsulants help eliminate head – in – pillow issues?

Yes, solder joint encapsulant products provide additional mechanical strength to solder joints to help mitigate the impact of warpage.

 

 

Why can electro-migration issues be eliminated using YINCAE solder joint encapsulants?

Solder joint encapsulants encapsulate the solder joints after reflow to prevent dendrite formation.

 

 

What is BP 256?

BP 256 is a ball bumping adhesives designed to enhance solder joint strength during ball bumping processes

 

Advantages

  1. Increase throughput
  2. Improve reliability
  3. Eliminate additional cleaning steps
  4. Eliminate underfilling process in SMT production
  5. Reduce costs

 

Is there more information BP 256 available?

A brochure specifically for BP 256 with more detailed information and reliability data is located on our website.

 

Is more information (i.e. TDS, additional material options…) for YINCAE solder joint encapsulant products available?

Yes, please contact us using one the links provided below.

 

Contact us for general questions

Contact us for technical inquiries

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IMAPS 2017-Raleigh 2 weeks away, visit YINCAE Booth 416

(Albany, NY) 25 September 2017 –  50th International Symposium on Microelectronics (IMAPS 2017) is 2 weeks away! The trade show will take place at Raleigh Convention Center in Raleigh, North Carolina, on October 10th and 11th. YINCAE hopes you stop at our booth 416 to learn more about YINCAE and the innovative products we have to offer.

Dr. Wusheng Yin, YINCAE Advanced Materials, LLC. will be presenting his latest white paper, “High Reliability and High Throughput Ball Bumping Process Solution – Solder Joint Encapsulant Adhesive” during the CPI Session TP1 Materials and Reliability I at 2:30 pm on Tuesday, October 10, 2017.  As pitch and solder ball size continue to shrink, reliability begins to decline rapidly.  Currently, the industry has adapted traditional; methods such as capillary underfilling and corner or edge bonding. However, as miniaturization continues, even these methods are creating a bottleneck.

YINCAE has developed solder joint encapsulants adhesives for ball bumping applications to eliminate this bottlenecking and allow miniaturization to continue while improving reliability, thermal cycling performance, drop test performance, and mechanical strength.

 

If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

 

* * * * * * * * * *

 Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

FAQ – Wafer Level Materials

WL66OWhat underfill materials can be used for wafer level applications?

YINCAE WL 125 series wafer level underfills

 

What die attach adhesive materials can be used for wafer level applications?

YINCAE WL 66H is designed for wafer level die attach applications

 

 

Does YINCAE offer wafer level lens or optical lens attachment materials?

Yes, YINCAE offers WL 66C, WL 66L, and WL 66O

 

 

Are the WL 66 C / L / O materials thermal or UV curable?

Both, these products are generally cured using UV for fast fixing purposes and then thermally cured for high reliability.

 

 

What are the advantages of YINCAE wafer level lens and optical lens attachment materials?

  1. High throughput and process yield
  2. High reliability
  3. Non – Yellowing

 

 

What is WTA 60 used for?

WTA 60 is a temporary bonding adhesive designed for thin wafer protection. WTA 60 prevents damage to wafers during standard semiconductor equipment processing. It is removed using YINCEA WTR 50.

 

 

What is WCP 45 used for?

 

WCP 45 is an aqueous polymer coating designed to protect wafers during laser dicing, drilling, and grooving procedures. It can easily be removed using D.I. water at room temperature.

 

 

What is ACP 120 used for?

ACP 120 is a nano film designed as a low-cost alternative to gold coatings currently used on pins.

 

 

Does YINCAE offer a conductive wafer level adhesive?

Yes, ACP 158 is an anisotropic conductive adhesive designed for wafer level applications.

 

 

There are four products in the WL 66 Series, what are the differences?

WL 66 C / L / O all have different viscosities and are intended for the same purpose: wafer level lens and optical lens attachment materials. WL 66H is designed for wafer level die attach applications

 

 

Are the products shown on your wafer level tree the only materials available in this category?

We have many more options. The products shown on the tree are our most popular materials. Please contact us if you are looking for a material with specific properties.

 

 

Is more information (i.e. TDS, additional material options, brochures…) regarding YINCAE wafer level materials available?

Yes, please contact us using one of the links provided below.

Contact us for general questions

Contact us for technical inquiries

 

Need Enhanced Reliability with Coating Materials?

YINCAE ACP 120 Anti-Oxidation Solderable Coating

ACP120

ACP 120 series are an anti-oxidation solderable coatings, which have been designed for anti-corrosion and rusting for metal surfaces such as nickel, steel, aluminum and other metals; solderable surfaces on which solder paste, solder preform or solder ball can be soldered. ACP 120 can be applied using dipping, immersion or spray method. After a metal is coated with ACP 120 solution, the coated metal surface can be dried at room temperature. The dried coating can be easily reworked using methylethyl ketone to remove, and the cleaned surface can be re-coated using ACP 120.

Press Release SMTA International 2017 – 1 week away – Booth 329

Join Dr. Yin’s Presentation September 20th

 

(Albany, NY) 12 September 2017–  SMTA is fast approaching. SMTA International will take place at the Donald Stephens Convention Center in Rosemont, IL.  September 17-21, 2017. YINCAE is scheduled to exhibit at booth # 329 September 19-20, 2017.

 

Dr. Wusheng Yin, the president of YINCAE Advanced Materials, is scheduled to speak at the technical conference. Dr. Yin will be presenting his white paper, “High Reliability and High Temperature Application Solution – Solder Joint Encapsulant Paste.” The presentation will be on held on Wednesday, September 20 at 9:00am in room 49.

 

YINCAE Advanced Materials, LLC is pioneering the way with their unique solder joint encapsulants, underfill materials, die attach adhesives, wafer lever materials, optoelectronic materials, and conformal coatings.  YINCAE has exclusive products that no other company has developed. The exhibiting YINCAE team hopes to see you at the convention to learn more about the YINCAE brand and the state-of-the-art products offered.

 

To learn more about YINCAE, please visit the YINCAE team at booth # 329.

 

The YINCAE team has begun scheduling booth meetings for SMTAI. If you would like to speak with Dr. Yin or other members of the YINCAE team, please email info@yincae.com.

 

If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

 

* * * * * * * * * *

Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

YINCAE to Exhibit at iMAPS 2017 – 1 month away

VISIT YINCAE Booth # 416

 October 10 – 11, 2017

 (Albany, NY) 11 September 2017 –  IMAPS New England 50th Symposium & Expo is less than a month away! YINCAE is proud to announce their continued support of the IMAPS organization and will exhibit at booth # 416. The trade show will take place at Raleigh Convention Center in Raleigh, North Carolina, on October 10th and 11th. The exhibiting YINCAE team will be available to answer questions and introduce innovative ways YINCAE materials may be of great benefit to current and future projects.

Dr. Wusheng Yin, YINCAE Advanced Materials, LLC. will be presenting his latest white paper, “High Reliability and High Throughput Ball Bumping Process Solution – Solder Joint Encapsulant Adhesive” during the CPI Session TP1 Materials and Reliability I at 2:30 pm on Tuesday, October 10, 2017.  As pitch and solder ball size continue to shrink, reliability begins to decline rapidly.  Currently, the industry has adapted traditional; methods such as capillary underfilling and corner or edge bonding. However, as miniaturization continues, even these methods are creating a bottleneck.

YINCAE has developed solder joint encapsulants adhesives for ball bumping applications to eliminate this bottle-necking and allow miniaturization to continue while improving reliability, thermal cycling performance, drop test performance, and mechanical strength.

If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

* * * * * * * * * *

 Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC

FAQ – Optoelectronic Materials

LEN66A

Does YINCAE offer UV-curable lens bonding adhesives?

Yes, YINCAE LEN 66A / 66AL are colorless, fast, UV curable bonding adhesives for lens bonding applications.

 

What are YINCAE UVA 88 Series products used for?

YINCAE UVA 88A Series products are dual cure UV adhesives designed for optical device bonding applications.

 

YINCAE UVA 88E Series products are dual cure UV encapsulants designed for optical device bonding applications.

 

What are YINCAE OF 66 Series products used for?

OF 66 B/C are dual cure (Heat + UV) optical, fiber optic, and optoelectronic devices.

 

What are YINCAE LCD 66 Series products used for?

 

YINCAE LCD 66F is a UV curable LCD end sealant offering low moisture absorption.

 

YINCAE LCD 66L is a UV curable, bio – compatible, optical bonding adhesive designed for LCD screen bonding applications.

 

What are the benefits of YINCAE LEN 66 Series products?

 

  1. Low thermal stress
  2. High throughput
  3. High process yield
  4. High reliability
  5. Excellent moisture resistance
  6. Withstands harsh environmental conditions

 

What are the benefits of YINCAE UVA 88 Series products?

  1. Low temperature cure
  2. High process yield
  3. High reliability
  4. Excellent moisture and solvent resistance

 

Does YINCAE offer a die attach adhesive(s) designed for optoelectronic applications?

Yes – DA 90UV

 

Are the products shown on your optoelectronic tree the only materials available in in this category?

We have many more options. The products shown on the tree are our most popular materials. Please contact us if you are looking for a material with specific properties.

Is more information (i.e. TDS, additional material options, brochures…) regarding YINCAE optoelectronic materials available?

Yes, please contact us using one of the links provided below.
Contact us for general questions

Contact us for technical inquiries