Coming Soon: FAQ Page

YINCAE FAQ Title

Frequently asked questions (FAQ) or Questions and Answers (Q&A), are listed questions and answers provided by our Technical Support team. The goal of creating a FAQ page is to ensure proper handling and usage of YINCAE materials.

Please be sure to check our new FAQ Page atwww.yincae.com for more information on common questions and concerns.

Have questions that are not listed? We would love to hear from you! Please email questions to info@yincae.com.

 

 

SMT 138 Dispense Test

Example of consistent dispense flow of YINCAE material: SMT 138

SMT 138 series include: SMT 138E, SMT 138P, and SMT 138T

SMT 138 series solderable conductive adhesives are rapid cure, self-leveling and self-soldering adhesives, which have been designed for low temperature (138◦C) Pb-free applications. By comparison with conductive adhesives (Ag), SMT 138 series solderable adhesives have higher stable electrical and thermal conductivity, outstanding reliability, and easily rework. By comparison with soldering materials, SMT 138 series solderable adhesives eliminate the out gassing from soldering process, flux residue issue and soldering bleed. During the reflow process, Solder joint encapsulant adhesives removes metal oxide and encapsulates individual solder joints with enhancing solder joint to eliminate some drawbacks of underfilling (large CTE above Tg, trouble process control). The performance of drop test has been improved by two orders of magnitude compared with that with the use of solder paste. The polymer network can be removed using methyl ethyl ketone (MEK) or heating.

We’re Going Places…

 

We are pleased to confirm that we will be exhibiting at SEMICON West in San Francisco, California on July 11th through the 13th. You will find our booth positioned in the NORTH HALL of the Moscone Center.

This year we will reside at booth # 5248. Feel free to stop by and say hi. Dr. Yin and our team have a wealth of knowledge in the SMT industry and would love to converse with you!

YINCAE Advanced Materials is a manufacturer of proprietary high performance adhesives, encapsulants and coatings for the electronics industry. Our products are focused on the central processor unit (CPU), providing new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices.

YINCAE adhesive products include: encapsulant, superfast cure adhesives for underfill replacement, solder joint encapsulant with eliminating underfilling process, solderable adhesives with high thermal and electrical conductivity for high power devices, optical adhesives for LCD, optoelectrical application, reactive thermal grease and thermal conductive adhesives.

 

semi17-hdpi-logo

IPC APEX EXPO is 2 Weeks Away

Press Release

IPC APEX EXPO 2017

VISIT YINCAE Booth # 823

(Albany, NY) 02/03/2016 –  IPC APEX EXPO 2 weeks away! The tradeshow will take place at San Diego Convention Center, in San Diego, CA., February 14-16, 2017. YINCAE hopes you will stop by our booth, to learn more about YINCAE and the innovative products we have to offer.

YINCAE Advanced Materials, LLC hopes that you will join us at the conference to learn about YINCAE and the products that we have to offer. YINCAE has exclusive products that no other company has developed. YINCAE hopes to see you there at the conference. Please visit us at our booth # 823!

YINCAE is to hold a Press Conference at booth #823 on February 14th at 1:30 pm to make major announcement.

If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

 

PRESS RELEASE: New Product Announcement 

(Albany, NY) January 24, 2017 – BP 256 is YINCAE’s new ball attach adhesive product. BP 256 has been designed to enhance solder joint reliability and eliminate cleaning processes for LEAD-FREE ball bumping procedures on CSP, BGA, Flip chip, and PoP devices. It is compatible with current ball bumping processes. BP 256 is generally applied via printing or pin transfer methods and can replace traditional solder paste, flux, and underfill. During reflow, BP 256 encapsulates individual solder joints improving both reliability and drop test performance. This product also has the benefit of being 100% reworkable. BP 256 is commercially available, is currently being used for ball bumping applications. Additional information on the BP 256 is available by contacting YINCAE at info@yincae.com. If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

Media Alert: Press Conference at IPC APEX EXPO 2017 Booth #823

Media Alert: Press Conference at IPC APEX EXPO 2017 BOOTH #823

 

Who Dr. Wusheng Yin is president of YINCAE Advanced Materials, LLC, a supplier of high performance coatings, adhesives and electronic materials, and a consultant of Howard University. Dr. Yin holds a Ph.D in polymer chemistry and physics from Institute of Chemistry, Academia Sinica. Dr. Yin has published over 100 journal articles and a few US patents in conducting polymers, organic/inorganic hybrid polymers, nanoparticles, adhesives, biomaterials and electronic materials.
What YINCAE to make major announcement concerning development of two groundbreaking adhesive materials for the electronics industry.
Where The Press Conference will be held on site, at the IPC APEX EXPO at the YINCAE booth #823.
When Tuesday, February 14th 2017 at 1:30 pm.
Why YINCAE has developed two new adhesives sure to revolutionize industry ball bumping and package level applications.
Contact Rebecca Wiley at Yincae_CS@yincae.com,

518-452-2880 (o) for scheduling questions.