YINCAE Advanced Materials Wins Global Technology Award at SMTAI 2022 for Adhesives/Underfills/Encapsulants

YINCAE Advanced Materials Wins Global Technology Award at SMTAI 2022 for Adhesives/Underfills/Encapsulants

 (Albany, NY) November 08, 2022 – YINCAE Advanced Materials, LLCis proud to announce that our company was awarded the 2022 Global Technology Award in the Adhesives, Underfills, and Encapsulants category! This ceremony took place on Wednesday, November 2nd at  SMTAI 2022 Exhibition in Minneapolis, USA.

YINCAE’s die attach material was recognized as one of the products that made the greatest impact on the electronics industry in the years 2021 and 2022. Due to its unique properties, YINCAE die attach adhesive has a high thermal conductivity and can achieve very thin bonding line thickness- there is no any bleeding and migration issue. It  has excellent bonding strength, a thermal cycling performance, and can withstand extreme temperatures ( -273°C) without any delamination.

About Global Technology Awards

The Global Technology Awards are universally recognized as the most international industry award, attracting entries from Europe, USA and Asia. Each year the Global Technology Awards recognize the latest innovations in production equipment and materials for the EMS industry by a distinguished panel of industry experts.

About YINCAE Advanced Materials, LLC

Founded in 2005, and headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives, and electronics materials used in electronic and optoelectronic devices. YINCAE products provide innovative solutions to support manufacturing processes from wafer level, to package level, to board level, and in final devices.

FOR ADDITIONAL INFORMATION CONTACT:

YINCAE Advanced Materials, LLC

19 Walker Way, Albany, NY  12205

Phone: (518) 452-2880

E-mail: info@yincae.com

The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

Fully Flux Residue Compatible, Room Temperature Fast Flow, Reworkable Underfill SMT 88UL2

(Albany, NY) December 20, 2021 YINCAE is excited to announce that we have developed and upgraded SMT 88UL to SMT 88UL2, a fully flux residue compatible, room temperature fast flow and easily reworkable underfill.  

The compatibility of underfill and flux residue has long been a traditional issue in the electronic industry. This compatibility issue normally leads to underfill flow issue, underfill voids, underfill delamination and solder extrusion during the double reflow process and automotive application. Typically, it is too costly to clean the flux residue in SMT assembly. SMT 88UL2 is designed to be fully compatible with the flux residues of almost all solder paste from major manufacturers. SMT 88UL2 can fast flow into any gap size (less than 1m) at room temperature and fast cure at lower temperatures without any flow and void issues eliminating cleaning flux residue. Our SMT 88UL2 can withstand multiple 260°C reflow process without any delamination, solder extrusion and solder ball issues without cleaning flux residue. It has demonstrated excellent drop and thermal cycling performance.

This material can be used as an underfill for flip chip, chip scale package, ball grid array devices, package on package, and land grid array applications. It is also suitable for bare chip protection in a variety of advanced packages such as memory cards, chip carriers, hybrid circuits and multi-chip modules. It is designed for high production and an environment where process speed and thermal dissipation are key concerns.

For more information on YINCAE’s SMT 88UL2 underfill, or to learn more about the YINCAE product range, please email us at: info@yincae.com. You can also find more information by visiting our website at: www.yincae.com

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

YINCAE’s New SMT 158N Series withstanding -273°C

(Albany, NY) February 11, 2021 YINCAE is excited to announce that we have developed SMT 158N series, including a non-flow, low temperature slow cure and high purity liquid epoxy underfill and capillary underfill encapsulant.

Due to its unique properties, SMT 158N series has a high viscosity and can be used as a dam material, corner bond, edge bond or as an encapsulant. Furthermore, the SMT 158N has lap shear and pull strength, and a thermal cycling performance that is significantly greater than that of the leading competitors’ underfills. The SMT 158N can withstand extreme temperatures ( -273°C), and still outperform current competitor products on the market. This not only has extraordinary implications for the use of SMT 158N but indicates the broad range of uses it potentially has across current industries.

This material can be used for flip chip, wafer-level chip scale package application. While also suitable for bare chip protection in a variety of advanced packages such as memory cards, chip carriers, hybrid circuits and multi-chip modules.

 It is designed for high production and an environment where process speed and reliability are the key concerns. This material is easily dispensed, minimizes induced stresses, provides outstanding reliability performance (e.g. temperature cycling performance), and excellent mechanical resistance.

For more information on YINCAE’s SMT 158N series underfill, or to learn more about the YINCAE product range, please email us at: info@yincae.com. You can also find more information by visiting our website at: www.yincae.com

Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

YINCAE Advanced Materials to Exhibit and Present at IMAPS Boston 2019 – Just 1 Month Away! Visit YINCAE at Booth #530

(Albany, NY) September 3, 2019 YINCAE Advanced Materials is proud to announce that we will be exhibiting at Booth #530 at this year’s IMAPS 2019 Boston 52nd International Symposium on Microelectronics.  The Symposium will be held at the Hynes Convention Center, in Boston, MA on October 1 – 2, 2019.

 

The International Microelectronics Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education.

 

YINCAE offers a variety of exclusive materials such as thermal interface and wafer-level /packaging level/board level materials, die attach adhesives and underfill that have been adopted by leading contract manufacturers and tier 1 microelectronic customers, and we are excited to be showcasing some or our most popular products at iMAPS 52nd International Symposium on Microelectronics.  YINCAE innovated the world’s first lead-free solder joint encapsulation adhesive solution for wafer level, flip chip, POP, LGA, BGA and many other applications.  YINCAE offers SJEA for low, medium and high temperature solder alloy applications for your unique applications.  YINCAE underfills not only offer high thermal conductivity and high Tg (245°C) but also can be used at over 400°C.

 

To schedule a meeting with the YINCAE team at Booth #530 during the Symposium, please email us at: yincae_cs@yincae.com with a brief description of the meeting topic. You can also find more information about our products by visiting our website at: http://www.yincae.com

 

We are looking forward to seeing you at this symposium! We produce cutting-edge products that are unique to the semiconductor industry. We will be available at our booth to talk about our products and answer any questions you may have.

 

For more information or if you have any questions, please feel free to visit our website at: www.yincae.com or give us a call at 518-452-2880.  We look forward to seeing you there.

 

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Founded and headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives, and electronic materials used in microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.  The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

IMAPS 2019 Boston is Just 1 Month Away! Visit YINCAE at Booth #530

(Albany, NY) September 3, 2019 YINCAE Advanced Materials is proud to announce that we will be exhibiting at Booth #530 at this year’s IMAPS 2019 Boston 52nd International Symposium on Microelectronics.  The Symposium will be held at the Hynes Convention Center, in Boston, MA on October 1 – 2, 2019.

 

The International Microelectronics Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education.

 

YINCAE offers a variety of exclusive materials such as thermal interface and wafer-level /packaging level/board level materials, die attach adhesives and underfill that have been adopted by leading contract manufacturers and tier 1 microelectronic customers, and we are excited to be showcasing some or our most popular products at iMAPS 52nd International Symposium on Microelectronics.  YINCAE innovated the world’s first lead-free solder joint encapsulation adhesive solution for wafer level, flip chip, POP, LGA, BGA and many other applications.  YINCAE offers SJEA for low, medium and high temperature solder alloy applications for your unique applications.  YINCAE underfills not only offer high thermal conductivity and high Tg (245°C) but also can be used at over 400°C.

 

To schedule a meeting with the YINCAE team at Booth #530 during the Symposium, please email us at: yincae_cs@yincae.com with a brief description of the meeting topic. You can also find more information about our products by visiting our website at: http://www.yincae.com

 

We are looking forward to seeing you at this symposium! We produce cutting-edge products that are unique to the semiconductor industry. We will be available at our booth to talk about our products and answer any questions you may have.

 

For more information or if you have any questions, please feel free to visit our website at: www.yincae.com or give us a call at 518-452-2880.  We look forward to seeing you there.

 

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Founded and headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives, and electronic materials used in microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.  The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.