YINCAE pic

SEMICON West Is Only 2 Weeks Away!

SEMICON West Is Only 2 Weeks Away
VISIT YINCAE AT BOOTH 6448

July 12 – 14, 2016

(Albany, NY) 23 June 2016 – The SEMICON West 2016, North America’s premier Microelectronics event is less than two weeks away! SEMICON West 2016 will be held at the Moscone Center in San Francisco, CA from July 12th to 14th. We sincerely invite you to stop by our Booth 6448 to learn more about YINCAE Advanced Materials.

YINCAE offers a variety of exclusive Adhesives, Thermal Interface, and Chip/Board/Packaging level materials that have been adopted by leading contract manufacturers and Tier 1 Microelectronic suppliers. Recipient of the 2015 Global Technology Award; YINCAE innovated the WORLD’s FIRST Lead-Free Solder Joint Encapsulation Adhesive solutions for wafer level, flip chip, POP, LGA, BGA and many more applications. YINCAE offers SJEA for low, medium, and high temperature solder alloy applications for your individualized needs.

YINCAE Advanced Materials, LLC hopes that you are finalizing preparation for the SEMICON WEST 2016. We are looking forward to seeing you in the North Hall at booth 6448 and will be available to talk about our products and answer any questions that you may have. We hope that you will join us at the conference to learn about YINCAE and the products that we have to offer. We develop exclusive products that no other company can provide. We look forward to seeing you at booth 6448! If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC

CONTACT INFO:

Dr. Wusheng Yin
Phone: (518) 452-2880
E-mail: info@yincae.com

YINCAE at ECTC in Las Vegas in 2 weeks!!

 

ECTC is 2 weeks away!

VISIT YINCAE BOOTH 506

June 1st to June 2nd

(Albany, NY) 5/17/2016 – ECTC is 2 weeks away! The tradeshow will take place at The Cosmopolitan hotel in Las Vegas, NV, June 1st and 2nd. YINCAE hopes you will stop by our Booth 506 to learn more about YINCAE and the innovative products we have to offer.

YINCAE offers a variety of exclusive Adhesives, Thermal Interface, and Chip/Board/Packaging level materials that have been adopted by leading contract manufacturers and Tier 1 Microelectronic suppliers. YINCAE innovated the WORLD’s FIRST Lead-Free Solder Joint Encapsulation Adhesive solutions and nano-underfil for wafer level, flip chip, POP, LGA, BGA and many more applications. YINCAE offers SJEA for low, medium, and high temperature solder alloy applications for your individualized needs.

The ECTC (Electronic Components and Technology Conference) is an International event that showcases the best in Packaging, Component and Microelectronic Systems, Science, Technology and Education in an environment or cooperation and technical exchange.

YINCAE Advanced Materials, LLC hopes that you will join us at the conference to learn about YINCAE and the products that we have to offer. YINCAE has exclusive products that no other company has developed. YINCAE hopes to see you there at the conference. Please visit us at booth 506!

If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

YINCAE AT ECTC BOOTH 506!

ECTC is 1 MONTH AWAY!

VISIT YINCAE BOOTH # 506

May 31st to June 3rd

(Albany, NY) 4/27/2016 – ECTC is only 1 month away! The tradeshow will take place at The Cosmopolitan hotel in Las Vegas, NV from May 31st to June 3rd. YINCAE hopes that you will stop by our Booth 506 to learn more about YINCAE and the innovative products we have to offer.

YINCAE offers a variety of exclusive Adhesives, Thermal Interface, and Chip/Board/Packaging level materials that have been adopted by leading contract manufacturers and Tier 1 Microelectronic suppliers. YINCAE innovated the WORLD’s FIRST Lead-Free Solder Joint Encapsulation Adhesive solutions for wafer level, flip chip, POP, LGA, BGA and many more applications. YINCAE offers SJEA for low, medium, and high temperature solder alloy applications for your individualized needs.

YINCAE Advanced Materials, LLC hopes that you will join us at the conference to learn about YINCAE and the solutions that we have to offer. We have exclusive products that no other company has developed. YINCAE hopes to see you there at the conference. Please visit us at booth 506!

If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

* * * * * * * * * *

Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

###

The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

 

IPC APEX 2016 is only 1 month away!

IPC APEX EXPO 2016

VISIT YINCAE BOOTH 1718

Join Dr. Yin’s Presentation on March 17th from 9AM-10AM

(Albany, NY) February 9, 2016 – The IPC APEX EXPO 2016 hosted by the Las Vegas Convention Center from March 15th – 17th is only one month away! This year’s Forward Thinking for Tomorrow’s Technology theme will offer unparalleled opportunities to access solutions to industry experts. We look forward for you to stop by our Booth 1718 to learn more about the innovative products and custom solutions that we offer.

On Thursday, March 17th, 2016 from 9:00AM – 10:00 AM, Dr. Yin will be presenting his paper, “Can Lower Temperature Solderable Adhesive Replace SAC Paste?” He will not only discuss the development of low temperature solderable adhesives to replace SAC applications, but the myriad of benefits for use across industry domains. The low temperature solderable adhesives can be used anywhere, particularly for wafer-level (CSP), package-level, and board-level (LGA, BGA, and QFN) to name a few. The low temperature solderable adhesive has improved drop performance by two magnitudes compared to Sn/Bi alloy and has improved reliability by equal or better than that of SAC alloy.

 

We at YINCAE Advanced Materials, LLC hope you will join us to learn about YINCAE and the exclusive products that you will not find with any other manufacturer in the world. We look forward to seeing you at booth 1718!

 

For more information, please visit our website: www.yincae.com

 

IPC APEX 2016 is only 2 months away!

IPC APEX EXPO 2016

VISIT YINCAE BOOTH 1718

Join Dr. Yin’s Presentation on March 17th from 9AM-10AM

(Albany, NY) January 18, 2016 – The IPC APEX EXPO 2016 hosted by the Las Vegas Convention Center from March 15th – 17th is only two months away! Featuring world-class educational opportunities with leaders in industry practice and research, this year’s Forward Thinking for Tomorrow’s Technology theme will offer unparalleled opportunities to access solutions to industry experts. We look forward to helping you to meet your challenges and invite you to stop by our Booth 1718 to learn more about the innovative products and custom solutions that we offer.

 On Thursday, March 17th, 2016 from 9:00AM – 10:00 AM, Dr. Yin, a global leader in adhesives research and manufacturing will be presenting his white paper, “Can Lower Temperature Solderable Adhesive Replace SAC Paste?” He will not only discuss the development of low temperature solderable adhesives to replace SAC applications, but the myriad of benefits for use across industry domains. The low temperature solderable adhesives can be used anywhere, particularly for wafer-level (CSP), package-level, and board-level (LGA, BGA, and QFN) to name a few. The reliability was equal or better than that of SAC alloy. The low temperature solderable adhesive has improved drop performance by two magnitudes compared to Sn/Bi alloy.

We at YINCAE Advanced Materials, LLC hope you will join us to learn about YINCAE and the exclusive products that you will not find with any other manufacturer in the world. We look forward to seeing you at booth 1718!

For more information, please visit our website: www.yincae.com