YINCAE at iMAPS New England

(Albany, NY) 12/31/2018 – YINCAE is proud to announce that we will be attending the iMAPS New England 46th Symposium and Expo at the Boxboro Regency Hotel in Boxborough, MA. The Annual New England Symposium & Expo is widely regarded as a regional convention held for the largest and most prestigious companies in the microelectronics industry.

YINCAE offers a wide range of products tailored to solve problems as well as increase efficiency—two key components that make our products unique. This year YINCAE Advanced Materials offers premier products including our Solder joint encapsulant paste which can provide lower temperature soldering and be used at a higher temperature (300⁰c). Our 50% filler nano-underfill can flow fast into small gaps (10m) at room temperature while our high-end underfills are fully compatible with flux residue and has zero gassing. We also offer Die Attach materials as well as Diamond Underfills. YINCAE continues to exceed customer expectations and develop specialized solutions for not only flip chip, CSP, BGA, POP, LGA, but also many more applications. You can also find more information on our website at: http://www.yincae.com.

We hope to see you at iMAPS Symposium!

YINCAE at iMAPS 2019- Boston

(Albany, NY) 12/31/2018 – YINCAE will be attending the 52nd Symposium on Microelectronics in Boston, MA from October 1-3, 2019 held at the Hynes Convention Center. We invite you to attend and visit our booth to learn what new and innovative products we have to offer this year.

This year YINCAE Advanced Materials offers premier products including our Solder joint encapsulant paste which can provide lower temperature soldering and be used at a higher temperature (300⁰c). Our 50% filler nano-underfill can flow fast into small gaps (10m) at room temperature while our high-end underfills are fully compatible with flux residue and has zero gassing. We also offer Die Attach materials as well as Diamond Underfills. YINCAE continues to exceed customer expectations and develop specialized solutions for not only flip chip, CSP,

BGA, POP, LGA, but also many more applications. We hope you take this opportunity to visit us at iMAPS where our experts will not only provide a unique perspective to your needs but also provide immediate product recommendations that are guaranteed to create a solution and improve efficiency.

For more information about our products and services, please visit our website at: www.yincae.com. We hope to see you at iMAPS 2019!

YINCAE at IPC APEX EXPO 2019

                                               IPC APEX 2019 is 1 month away! 

(Albany, NY) 12/28/2018 – The IPC APEX 2019 trade show will take place at the San Diego Convention Center, in San Diego, CA, from January 29-31, 2019. Our team will be showcasing our wide range of specialized products as well as create solutions of your manufacturing needs. We hope to see you at Booth #1720 in North Hall, to learn more about YINCAE and these innovative products we have to offer.

This year YINCAE Advanced Materials offers premier products including our Solder joint encapsulant paste which can provide lower temperature soldering and be used at a higher temperature (300⁰c). Our 50% filler nano-underfill can flow fast into small gaps (10m) at room temperature while our high-end underfills are fully compatible with flux residue and has zero gassing. We also offer Die Attach materials as well as Diamond Underfills. YINCAE continues to exceed customer expectations and develop specialized solutions for not only flip chip, CSP, BGA, POP, LGA, but also many more applications.

To schedule a meeting with the YINCAE team during the exhibition, please email us at: info@yincae.com with a brief description of the meeting topic and we will gladly reserve a time to see you. You can also find more information by visiting our website at: www.yincae.com. We hope to see you at the exhibition!

* * * * * * * * * *

 

Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

###

The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

 

YINCAE’s New Underfill with Zero Outgassing: SMT 158HA

(Albany, NY) September 4, 2018 YINCAE is excited to announce that we have developed SMT 158HA, an underfill with zero outgassing that is fully compatible with flux material.

Due to its unique properties, SMT 158HA completely eliminates the cleaning process both after reflow and after curing. Zero outgassing means that there is no weight loss during curing therefore nearby solder balls and other components do not become contaminated. Also, the flux residue does not need to be removed before SMT 158HA is applied.

SMT 158HA was initially developed for high temperature applications, and can withstand temperatures of up to 400ºC. It also withstands up to 5x reflow.

This material can be used for flip chip, wafer-level chip scale package application. It is also suitable for bare chip protection in a variety of advanced packages such as memory cards, chip carriers, hybrid circuits and multi-chip modules. It is designed for high production and friendly environment where process speed and mechanical shock are key concerns.

For more information on YINCAE’s SMT 158HA underfill, or to learn more about the YINCAE product range, please email us at: info@yincae.com. You can also find more information by visiting our website at: www.yincae.com

* * * * * * * * * *

Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

###

The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

YINCAE at IWLPC 2018

(Albany, NY) July 16, 2018: YINCAE is excited to announce that we will be attending the 15th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition in San Jose, CA this year from October 23rd-25th at the Double Tree by Hilton. This conference brings together many of the top performers in the semiconductor industry and addresses all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing.

 

As we prepare for the upcoming event, we hope that you are looking to attend the show as well. Come by our Booth 47 and take one of our informative pamphlets, learn more about the array of products we supply, and ask us any questions that you may have. YINCAE hopes that you will be attending the show and stop by to learn more about our company and the innovative products that we have to offer!

 

YINCAE has unique and exclusive products that no other company has developed. There is a lot that can be taken away from not only our booth and products, but from the IWLPC 2018 as a whole. YINCAE hopes to see you there at the IWLPC 2018 at Booth 47!

 

                                                             * * * * * * * * * *

Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

###

The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

SEMICON WEST 2018 starts next Tue July 10th! VISIT YINCAE BOOTH 5269

(Albany, NY) July 3, 2018 – SEMICON West 2018, North America’s premier Microelectronics event, is just one week away! The show will be held at the Moscone Center in San Francisco, CA from July 10th to 12th. YINCAE sincerely invites you to stop by our Booth #5269 to speak with our experts and to see what’s new.
We are noticing an emerging trend in underfill and thermal materials and would love to showcase a wide range of materials varying from the World’s first commercial diamond underfill, to a high filler-load underfill that can flow into small gaps at room temperature, a solder joint encapsulant paste that has low temperature reflow and high pull strength at high temperature (300℃), a reflowable (filled) underfill that is excellent for applications with a narrow footprint and lastly, a mold underfill with a 90% filler load able to flow into 25μm gap without external force.
These are the materials you need and YINCAE Advanced Materials, LLC hopes that you are finalizing preparation for the SEMICON WEST 2018. We are looking forward to seeing you in the Moscone Center at booth 5269 and will be available to talk about our products and answer any inquiries you may have. We hope that you will join us at the conference to learn about our exclusive products that no other company offers. We look forward to seeing you at booth 5269!

UnderfillTreePoster3