Month: August 2014

SMTA International 2014 is 1 month away!!

               The SMTA International conference and exhibition 2014 is less than one month away. SMTA International will take place from September 28th to October 2nd. It will be held at the Donald Stephens Convention Center in Rosemont, Illinois. YINCAE hopes that you stop by our booth 811 to learn about YINCAE and the innovative products that we have to offer.

                Dr. Wusheng Yin, the president of YINCAE Advanced Materials LLC, is going to be speaking at the SMTA International conference and exhibition. Dr. Yin will be speaking on Wednesday, October 1st at approximately 11am in room 49. Dr. Yin’s presentation is a part of MFX 5, the “Adhesive Applications” section. Dr. Yin will be presenting his white paper, “An Innovative Reliability Solution to Interconnect of Flexible/Rigid Substrates.” This paper will focus on the trend of miniaturization and how it affects the electronics industry. The paper discusses how YINCAE is able to help adapt to these changes through utilization of the products that we have to offer. Dr. Yin will be also talking about the groundbreaking products that YINCAE has developed and are commercially available.

                YINCAE Advanced Materials, LLC hopes that you are finishing preparation for the SMTA conference and exhibition 2014. We are looking forward to seeing you at booth 811 and will be available to talk about products and answer any questions that you may have. YINCAE hopes that you will come join us at the conference to learn about YINCAE and the products that we have to offer. We have exclusive products that no other company has developed. There is a lot that can be taken away from not only Dr. Yin’s presentation, but from the SMTA International conference as a whole. We hope to see you there!


If you wish to read the white paper “An Innovative Reliability Solution to Interconnect of Flexible/Rigid Substrates,” please click the following link: White Paper – YINCAE.

If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

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YINCAE Advanced Materials, LLC is a leading manufacturer and supplier of high-performance coatings, adhesives and encapsulants used in the computer microchip and optoelectronics industries. Our manufacturing operations and headquarters are located in Albany, NY USA, with technical sales and support available through a worldwide sales and service organization.


The YINCAE brand name and logo are registered trademarks of YINCAE Advanced Materials, LLC.

Ground Breaking Underfill: SMT 158 Series

                YINCAE Advanced Materials, LLC is pleased to announce the availability of a series of new underfill products that enables fast flowing, excellent reliability, and use on several different applications. This combination of characteristics enables SMT 158 series to be the world’s best flip chip underfill.

                The SMT 158 series is customizable in color, filler concentration, and particle sizes to meet each individual customer’s needs. This underfill has excellent reliability and has an extremely fast flow. It cures fast and in low temperatures. It can be utilized for bare chip protection in advanced packages like memory cards, chip carriers, hybrid circuits, and multi-chip modules. Using SMT158 will eliminate the cleaning process. SMT 158 series is compatible with lead free processes and is good for ultra-low bump applications. It can be used on several applications like chip scale packages, ball grid array devices, PoP, land grid array, and some flip chip applications. SMT 158 series provides mechanical resistance and minimizes induced stresses.

                Underfill products have been around for a while, however an underfill product like the SMT 158 series distinguishes itself from the competition. It can be applied to several applications and is customizable to meet the needs of the customers.

                Additional information on the product series is available on our Website at: or by contacting YINCAE at:

A 5cc Syringe of SMT 158

A 5cc Syringe of SMT 158

SMT 256/266 – Solder Joint Encapsulant

The SMT 256/266 series is the world’s first solder joint encapsulant.

The feautures of the SMT 256/266 series are:

  • It enhances solder strength 5-10x. It greatly enhances joint reliability
  • It eliminiates cracking in microchip applications & COMPLETLY eliminates the underfill process
  • It improves process yield
  • High cost reduction and enables higher throughput
  • 100% reworkability
  • Can be dipped, jetted, or brushed
A 5cc syringe of our SMT 256 solder joint encapsulant

A 5cc syringe of our SMT 256 solder joint encapsulant