Month: September 2014

Solder Joint Encapsulant for Ball Bumping Applications: BP 256

Solder Joint Encapsulant for Ball Bumping Applications:

BP 256 

(Albany, NY)    September 19, 2014.  YINCAE Advanced Materials, LLC is pleased to announce the release and availability of BP 256. It is a part of the innovative SMT 256/266 series, solder joint encapsulant.

YINCAE’s BP 256 is for BGA, CSP, Flip Chip, POP, and other ball bumping applications. The BP 256 can enhance solder joint reliability and eliminate solder joint cracking in microchip applications, creating a solder joint bond that is 5-to-10 times stronger than a conventional solder joint. Thus, using BP 256 eliminates the cleaning process due to the nature of epoxy and the later underfilling process. The products are also designed for use in lead-free, Sn/Pb and Sn/Bi processes.

Although encapsulant products are not new, the industry has been hard pressed to find an encapsulant that performs like the BP 256. YINCAE’s BP 256 eliminates the need for flux, underfilling, and the cleaning process.  BP 256 demonstrates superior performance, can be applied at low temperatures, and is 100% reworkable.

Additional information on the product series is available on our Website at: http://www.yincae.com/technical-information.html or by contacting YINCAE at: tfarrell@yincae.com.

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YINCAE Advanced Materials, LLC is a leading manufacturer and supplier of high-performance coatings, adhesives and encapsulants used in the computer microchip and optoelectronics industries. Our manufacturing operations and headquarters are located in Albany, NY USA, with technical sales and support available through a worldwide sales and service organization.

FOR ADDITIONAL INFORMATION CONTACT:

Taylor Farrell

Business Development Specialist

YINCAE Advanced Materials, LLC

19 Walker Way

Albany, NY  12205

Phone: (518) 452-2880

E-mail: tfarrell@yincae.com

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

SMTA International is just 2 weeks away!

(Albany, NY) September 16, 2014.  YINCAE Advanced Materials is excited to announce the world’s first solder joint encapsulant series, SMT 256/266. We will be promoting the SMT 256/266 series at the SMTA International 2014 on September 30th – October 1st, at the Donald Stephens Convention Center, Booth #811. Stop by to see for yourself the dramatic differences that the SMT 256/266 series can have on your soldering performance and processes. You can register for a free electronics exhibition pass by clicking
here if you have yet to sign up.

Mention this email or any of our previous ones at booth #811 during the SMTA International and receive a discount on your first or next order of SMT 256/266 series. If you wish to schedule an appointment during the show, please do so by sending an email to tfarrell@yincae.com or calling (518) 452-2880. We hope to see you in a few weeks!

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YINCAE Advanced Materials, LLC is a leading manufacturer and supplier of high-performance coatings, adhesives and encapsulants used in the computer microchip and optoelectronics industries. Our manufacturing operations and headquarters are located in Albany, NY USA, with technical sales and support available through a worldwide sales and service organization.

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*The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

THE IMAPS 2014 International Symposium on Microelectronics is a little over 1 month away! We hope that you will visit us at booth 326!

 

YINCAE President, Dr. Wusheng Yin, to Speak at IMAPS 2014

 

(Albany, NY) September 9, 2014.  Dr. Wusheng Yin, the president of YINCAE Advanced Materials LLC, is going to be speaking at the upcoming IMAPS 2014 conference. IMAPS 2014 will take place from October 14th to 16th. It will be held at the Town & Country Resort and Conference Center in San Diego California.

                Dr. Yin will be presenting his white paper, “SOLDERABLE ANISOTROPIC CONDUCTIVE ADHESIVES FOR 3D PACKAGE APPLICATIONS”. This paper will focus on the trend of increased usage of 3D packaging and how the implementation 3D packaging is changing the electronics industry. The paper discusses how YINCAE is able to deal with these changes through developed products like the solderable anisotropic adhesive for 3D package applications. Dr. Yin will be also talking about the other groundbreaking products that YINCAE has developed and are commercially available.

                YINCAE Advanced Materials, LLC hopes that you will come join us at the conference to learn about YINCAE and the products that we have to offer. YINCAE has exclusive products that no other company has developed. There is a lot that can be taken away from not only Dr. Yin’s presentation, but from IMAPS 2014 as a whole. YINCAE hopes to see you there at the IMAPS 2014. Please visit us at booth 326!

                Dr. Yin is a pioneer in the field of encapsulant adhesives and has developed several encapsulant products that have been successfully adopted by major microelectronics product and contract manufacturers. His encapsulant products have solved a number of technical issues related to microchip solder joint strength, uniformity and thermocycling. Tests comparing flux in nitrogen versus encapsulants in normal air flow have demonstrated that encapsulants can increase pull strength by 5 times while reducing thermal cycling failures by 10 times, with a reduction in solder voids of up to 79%. This data translates to significant production savings for microelectronics manufacturers.

 

If you wish to read the white paper “SOLDERABLE ANISOTROPIC CONDUCTIVE ADHESIVES FOR 3D PACKAGE APPLICATIONS”, please click the following link: White Paper

If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

 

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YINCAE Advanced Materials, LLC is a leading manufacturer and supplier of high-performance coatings, adhesives and encapsulants used in the computer microchip and optoelectronics industries. Our manufacturing operations and headquarters are located in Albany, NY USA, with technical sales and support available through a worldwide sales and service organization.

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The YINCAE brand name and logo are registered trademarks of YINCAE Advanced Materials, LLC.