Month: October 2014

The Future of Solder Joint Encapsulation

YINCAE President, Dr. Wusheng Yin, presents:

“The Future of Solder Joint Encapsulation”

IPC Tech Summit 2014 in Raleigh, NC

(Albany, NY) October 24, 2014.  Dr. Wusheng Yin, President of YINCAE Advanced Materials LLC, will be presenting in the Technical Session on “The Future of Solder Joint Encapsulation” at the upcoming IPC Tech Summit, with the event being held from Oct 28th to 30th in Raleigh, NC.

Following is the Abstract taken from the paper on “The Future of Solder Joint Encapsulation”

   “Solder joint encapsulant adhesives have been successfully used for many years by major electronics manufacturers to enhance the strength of solder joints. These products have proven to strengthen solder joints 5-10x over traditional methods, and have greatly improved thermal cycling during the soldering process as well as the drop performance in the finished products.  The use of solder joint encapsulant adhesives can eliminate the need for underfill materials and the underfill process altogether, thus simplifying rework, which results in a lower cost of ownership.   Solder joint strength, however, continues to be a problematic issue with increased package on package and system on package miniaturization.

Research tests were performed to compare the solder joint strength using flux in nitrogen reflow process versus solder joint encapsulant in air reflow process.  Using flux in nitrogen, the top PoP had a solder joint height of 11.85 mil with 0.9 mil warpage and 5.25% solder voids.  In comparison, using solder joint encapsulant in air, the PoP had a solder joint height of 11.33 mil with 0.8 mil warpage and 2.93% solder voids. The pull strength of solder joint was 71N using flux compared to 352N using the solder joint encapsulant. The first thermal cycling failure was increased from 495 cycles using underfill, to around 5000 cycles using the solder joint encapsulant. From the data, it is evident that solder joint encapsulant provides a very promising solution for solder joint strength in the evolution of miniaturized electronic packaging. In this presentation, we are going to discuss the details and future of solder joint encapsulant adhesives.”

The IPC Organization holds several key technical events throughout the calendar year and YINCAE Advanced Materials is pleased to be a corporate member and event participant.   YINCAE Advanced Materials will exhibit at the IPC APEX Expo held February 2015 in San Diego, CA.

Visit the web link at www.yincae.com for information on the range of Advanced Materials or Email Taylor Farrell: tfarrell@yincae.com Phone number: (518) 452-2880 HQ in Albany, NY

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YINCAE Advanced Materials, LLC is a leading manufacturer and supplier of high-performance coatings, adhesives and encapsulants used in the computer microchip and optoelectronics industries. Our manufacturing operations and headquarters are located in Albany, NY USA, with technical sales and support available through a worldwide sales and service organization.

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The YINCAE brand name and logo are registered trademarks of YINCAE Advanced Materials, LLC.

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YINCAE Advanced Materials – Presentation by Dr. Yin at IMAPS 2014

YINCAE Advanced Materials, LLC wishes to thank all of those who attended Dr. Yin’s presentation and those who visited our booth during the 47th International Symposium on Microelectronics. YINCAE Advanced Materials staff was pleased with the excellent attendance during the presentation by YINCAE President, Dr. Wusheng Yin. His presentation was titled “Solderable Anisotropic Conductive Adhesives for 3D Package Applications”. This advanced material presentation was given during the technical sessions at the IMAPS 2014 International Microelectronics Symposium.  The technical sessions were held Oct 13th – 16th at the Towne & Country Conference Center in San Diego, California.

The annual event also included a two day Exhibition from Oct 14th – 15th, allowing YINCAE Staff to showcase an advanced Solder Joint Encapsulant Series SMT 256/266.  Technical and sales staff were available with Dr. Yin, during the exhibition, to address questions on this Solder Joint Encapsulant Series and many other innovative electronic assembly materials. Applications for the range of YINCAE Advanced Materials include; wafer coating and wafer bonding, die attach, underfilling and product conformal coating.

YINCAE is a corporate member and sponsor of the global IMAPS organization, (International Microelectronics Assembly and Packaging Society) with plans already in place to exhibit and present at the IMAPS 2015 conference. We look forward to seeing all of you at IMAPS 2015 in Orlando, Florida!

If you wish to read the white paper “SOLDERABLE ANISOTROPIC CONDUCTIVE ADHESIVES FOR 3D PACKAGE APPLICATIONS”, please click the following link: White Paper

Visit the web link at yincae.com for information on the Advanced Materials or email Taylor Farrell: tfarrell@yincae.com Phn # (518) 452-2880 at HQ in Albany, NY

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YINCAE Advanced Materials, LLC is a leading manufacturer and supplier of high-performance coatings, adhesives and encapsulants used in the computer microchip and optoelectronics industries. Our manufacturing operations and headquarters are located in Albany, NY USA, with technical sales and support available through a worldwide sales and service organization.

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The YINCAE brand name and logo are registered trademarks of YINCAE Advanced Materials, LLC.

YINCAE Advanced Materials Displayed Great Success at SMTA International 2014

(Albany, NY) October 9, 2014. YINCAE Advanced Materials, LLC wishes to thank all of those who attended Dr. Yin’s presentation and those who visited our booth during the SMTA International 2014. We hope that you got a chance to learn about YINCAE and the exclusive products that we have to offer.

smta 14

YINCAE was an exhibitor in the largest SMTA International Conference to date. It was held from September 28th to October 2nd at the Donald Stephens Convention Center in Rosemont, Illinois. YINCAE was a gold sponsor for the SMTA 30th anniversary, a golf sponsor for the 7th annual SMTAI golf tournament, as well as an advertiser in the inside front cover of the show directory. We also occupied booth #811 during the event.

Dr. Wusheng Yin, the president of YINCAE Advanced Materials LLC, spoke at the SMTA International conference and exhibition, and presented his white paper, “An Innovative Reliability Solution to Interconnect of Flexible/Rigid Substrates.” This paper focused on the trend of miniaturization and how it affects the electronics industry. The paper discusses how YINCAE is able to help adapt to these changes through utilization of the products that we have to offer.

We are excited about the growth and future of YINCAE Advanced Materials. Conferences and events like the SMTA International are a great way to gain recognition for your company. We look forward to seeing all of you at SMTA International 2015!

If you wish to read the white paper “An Innovative Reliability Solution to Interconnect of Flexible/Rigid Substrates,” please click the following link: White Paper – YINCAE.

If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

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YINCAE Advanced Materials, LLC is a leading manufacturer and supplier of high-performance coatings, adhesives and encapsulants used in the computer microchip and optoelectronics industries. Our manufacturing operations and headquarters are located in Albany, NY USA, with technical sales and support available through a worldwide sales and service organization.

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The YINCAE brand name and logo are registered trademarks of YINCAE Advanced Materials, LLC.

YINCAE Advanced Materials Exhibiting at IMAPS 2014

(Albany, NY) October 9, 2014. YINCAE Advanced Materials will be a key exhibitor next week during IMAPS International Symposium on Microelectronics 2014 conference and exhibition, in booth # 326, showcasing the advanced solder joint Encapsulant Series SMT 256/266.  YINCAE President, Dr. Wusheng Yin, will be conducting a technical program session during IMAPS. It will take place on Tuesday October 14th from 9:00am – 9:30am in the Royal Palms Salon 5/6. It is titled “Solderable Anisotropic Conductive Adhesives for 3D Package Application”. Stop in and listen to Dr. Yin speak about the industry and groundbreaking products that YINCAE Advanced Materials has to offer.

YINCAE technical staff will be available to address questions on the encapsulant series and other innovative electronic assembly materials used for wafer coating and bonding, die attach, underfill and product conformal coating. Organized by the International Microelectronics Assembly and Packaging Society, this year’s IMAPS International Symposium on Microelectronics Exhibition will be held October 14th – October 16th, at the Towne & Country Resort and Conference Center in San Diego, California. Please visit the YINCAE booth # 326 for details on the dramatic difference the SMT 256/266 material series can have on your soldering performance and processes.

Mention this email at YINCAE Advanced Materials booth #326 during the IMAPS International Symposium on Microelectronics and receive a discount on your first or next order of SMT Series 256/266.  To schedule an appointment during the exhibition, or request information, please send an email to Taylor Farrell: tfarrell@yincae.com or call (518) 452-2880. We look forward to seeing you there!

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YINCAE Advanced Materials, LLC is a leading manufacturer and supplier of high-performance coatings, adhesives and encapsulants used in the computer microchip and optoelectronics industries. Our manufacturing operations and headquarters are located in Albany, NY USA, with technical sales and support available through a worldwide sales and service organization.

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*The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.