Month: January 2015

YINCAE Advanced Materials Presenting & Exhibiting During Upcoming IPC APEX EXPO

(Albany, NY) January 26, 2015.  The IPC APEX EXPO is under one month away. The IPC APEX EXPO will take place from February 22nd to 26th. It will be held at the San Diego Conference Center in San Diego, California. YINCAE hopes that you will stop by our booth 608 to learn about YINCAE and the innovative products that we have to offer.

Dr. Wusheng Yin, President of YINCAE Advanced Materials, will be presenting his white paper, “A Lower Temperature Solder Joint Encapsulant for Sn/Bi Applications.” He will be presenting February 25th from 3:30 – 4:00 pm. It will be a technical conference session about assembly processes held in room 1A. This paper will focus on the electronic industry and the high interest in low temperature soldering processes. The paper discusses how YINCAE developed several products to meet these new industry demands – something that has been long desired but has seemed unobtainable until now. Dr. Yin will also be talking about the groundbreaking products that YINCAE has developed and are currently available.

Dr. Yin will also be participating and speaking at the PCB Supply Chain Leadership Meeting. This is an exclusive, invitation only event that takes place during the upcoming IPC APEX EXPO. Dr. Yin was specially asked to give an encore presentation to top executives and presidents of the IPC member companies. He will be speaking at 2:30 PM in room 6D. The entire PCB Supply Chain Leadership Meeting will be held Monday February 23rd from 8 am to 5 pm at the San Diego Convention Center in San Diego, California.

YINCAE Advanced Materials, LLC hopes that you are finalizing preparation for the IPC APEX EXPO. We are looking forward to seeing you at booth 608 and will be available to talk about products and answer any questions that you may have. YINCAE hopes that you will come join us at the conference to learn about YINCAE and the products that we have to offer. We have exclusive products that no other company has developed. There is a lot that can be taken away from not only Dr. Yin’s presentation, but from the IPC APEX EXPO as a whole. We look forward to seeing you at booth 608. We hope to see you there!

If you wish to read the white paper “A Lower Temperature Solder Joint Encapsulant for Sn/Bi Applications.” please click the following link: White Paper

If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

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YINCAE Advanced Materials, LLC is a leading manufacturer and supplier of high-performance coatings, adhesives and encapsulants used in the computer microchip and optoelectronics industries. Our manufacturing operations and headquarters are located in Albany, NY USA, with technical sales and support available through a worldwide sales and service organization.

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The YINCAE brand name and logo are registered trademarks of YINCAE Advanced Materials, LLC.

YINCAE President, Dr. Wusheng Yin, Discusses Solder Joint Encapsulant & POP Assembly Solutions

(Albany, NY) January 13, 2015.  YINCAE Advanced Materials LLC, is now published in the Global SMT & Packing Magazine for January 2015 titled, Solder Joint Encapsulant Adhesive-POP Assembly Solution.  This article explains extensively about solder joint encapsulant adhesives in comparison to traditional solder paste and the positive outcomes that YINCAE encapsulants can provide.

Global SMT & Packaging is the global assembly journal for SMT and advanced packaging professionals.  They are also the #1 magazine dedicated to the global electronics manufacturing and assembly industry.

From the publication, it is easy to find material that intends to make the manufacturing process as simple as possible with the using solder joint encapsulant adhesives. YINCAE’s SMT256 and SMT266 both eliminate the use of underfill materials and the underfilling process.  This is a great solution for POP assembly.  Based on test results, the use of SMT 256 under air reflow the void percentage of the solder joint was reduced to 2.5 percent.  The use of SMT 256 was used for under air reflow and was in comparison of 5% to using tacky flux under the reflow of nitrogen.

YINCAE’s solder joint encapsulant is a total assembly solution for the advanced POP, especially with TMV. Not only does it increase solder joint strength by 5 times, but it also provides excellent reliability for advanced IC components.  Using solder joint encapsulant for POP assembly proves to provide benefits such as the elimination of head-in-pillow issues, preventing dendrite formation, eliminating the difficult underfilling process, particularly for POP with TMV, easy rework, and enhanced reliability.

If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

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YINCAE Advanced Materials, LLC is a leading manufacturer and supplier of high-performance coatings, adhesives and encapsulants used in the computer microchip and optoelectronics industries. Our manufacturing operations and headquarters are located in Albany, NY USA, with technical sales and support available through a worldwide sales and service organization.

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The YINCAE brand name and logo are registered trademarks of YINCAE Advanced Materials, LLC.

YINCAE President, Dr. Wusheng Yin, To Speak and Give Encore Presentation At Executive Leadership Meeting

YINCAE President, Dr. Wusheng Yin,

To Speak and Give Encore Presentation At

Executive Leadership Meeting

(Albany, NY) January 5, 2015.  Dr. Wusheng Yin, the president of YINCAE Advanced Materials LLC, is going to be participating and speaking at the PCB Supply Chain Leadership Meeting. This is an exclusive, invitation only event that takes place during the upcoming IPC APEX EXPO. Dr. Yin was specially asked to give an encore presentation to top executives and presidents of the IPC member companies. The PCB Supply Chain Leadership Meeting will be held Monday February 23rd from 8 am to 5 pm at the San Diego Convention Center in San Diego, California.

The PCB Supply Chain Leadership Meeting held during the IPC APEX EXPO is a time where senior-executive level management IPC members get together and address issues related to improving executive decision-making in the industry, focusing on market trends, customer requirements and the economy. The daylong meeting has several different sessions that focus on different topics of interest. Presentations will be delivered throughout the day. Dr. Wusheng Yin and YINCAE Advanced Materials are honored to be invited to attend and present at this exclusive event.

Dr. Yin will be presenting his white paper, “The Future of Solder Joint Encapsulant Adhesives.” This paper will focus on the electronic industry and the increasing interest in using solder joint encapsulants. The paper discusses how YINCAE has developed the solder joint encapsulant product family and the benefits that it can bring to a manufacturer’s assembly process.

In addition to the Leadership Meeting, YINCAE Advanced Materials, LLC will be exhibiting during IPC APEX EXPO. YINCAE staff will be on hand and available to discuss YINCAE products and address any questions. YINCAE hopes to see you there at the IPC APEX EXPO. Please visit us at booth 608!

Dr. Yin is a pioneer in the field of encapsulant adhesives and has developed several encapsulant products that have been successfully utilized by major microelectronics product and contract manufacturers. His encapsulant products have solved a number of technical issues related to microchip solder joint strength, uniformity, and thermocycling. Tests comparing flux in nitrogen versus encapsulants in normal air flow have demonstrated that encapsulants can increase pull strength by 5 times, while reducing thermal cycling failures by 10 times, with a reduction in solder voids of up to 79%. This data translates to significant production savings for microelectronics manufacturers.

If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

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YINCAE Advanced Materials, LLC is a leading manufacturer and supplier of high-performance coatings, adhesives and encapsulants used in the computer microchip and optoelectronics industries. Our manufacturing operations and headquarters are located in Albany, NY USA, with technical sales and support available through a worldwide sales and service organization.

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The YINCAE brand name and logo are registered trademarks of YINCAE Advanced Materials, LLC.