We at YINCAE Advanced Materials are thrilled to announce that we will be in attendance at this year’s SEMICON West, North America’s premier Microelectronics event. This year SEMICON West 2015 will be hosted by the one and only Moscone Center in San Francisco, CA. With an estimated attendance of almost 30,000 Industry Professionals, in addition to a number of Networking events, SEMICON West will be highlighting some of the more critical issues we will be facing in the future of Semiconductor Manufacturing with TechXPOT, a full symposium planned and ”Generation Next” pavilions, a new concept that will integrate exhibits, tech sessions and networking events with contemporary industry trends for a more holistic engagement approach. With more than 600 International Exhibitors, almost 200 hours of Technical Programming and a world class Keynote Panel that is not to be missed, we at YINCAE Advanced Materials look forward to the meeting of minds and hope you will join us.
YINCAE offers a variety of exclusive Adhesives, Thermal Interface, and Chip/ Board/ Packaging level materials that have been adopted by leading contract manufacturers and Tier 1 Microelectronic suppliers. Dr. Yin, Founder and President of YINCAE Advanced Materials created the WORLD’s FIRST Lead -Free Solder Joint Encapsulation Adhesive solutions for wafer level, flip chip, POP, LGA, BGA and many more. YINCAE offers SJEA for low, medium, and high temperature solder alloy applications with differential chemistry and electrical/ thermal conductivity for your individualized needs. We invite you to visit our booth #6072 to learn more about the wide array of material solutions we offer and join the Technical Brainstorm that is SEMICON West 2015.
For more information or if you have any questions please feel free to contact the YINCAE Headquarters: www.yincae.com or 518-452-2880. We look forward to seeing you there.