Month: May 2015

VISIT US AT SEMICON WEST THE MARKETPLACE FOR MICROELECTRONIC INNOVATION

YINCAE picWe at YINCAE Advanced Materials are thrilled to announce that we will be in attendance at this year’s SEMICON West, North America’s premier Microelectronics event. This year SEMICON West 2015 will be hosted by the one and only Moscone Center in San Francisco, CA. With an estimated attendance of almost 30,000 Industry Professionals, in addition to a number of Networking events, SEMICON West will be highlighting some of the more critical issues we will be facing in the future of Semiconductor Manufacturing with TechXPOT, a full symposium planned and ”Generation Next” pavilions, a new concept that will integrate exhibits, tech sessions and networking events with contemporary industry trends for a more holistic engagement approach. With more than 600 International Exhibitors, almost 200 hours of Technical Programming and a world class Keynote Panel that is not to be missed, we at YINCAE Advanced Materials look forward to the meeting of minds and hope you will join us.

YINCAE offers a variety of exclusive Adhesives, Thermal Interface, and Chip/ Board/ Packaging level materials that have been adopted by leading contract manufacturers and Tier 1 Microelectronic suppliers. Dr. Yin, Founder and President of YINCAE Advanced Materials created the WORLD’s FIRST Lead -Free Solder Joint Encapsulation Adhesive solutions for wafer level, flip chip, POP, LGA, BGA and many more. YINCAE offers SJEA for low, medium, and high temperature solder alloy applications with differential chemistry and electrical/ thermal conductivity for your individualized needs. We invite you to visit our booth #6072 to learn more about the wide array of material solutions we offer and join the Technical Brainstorm that is SEMICON West 2015.

 For more information or if you have any questions please feel free to contact the YINCAE Headquarters: www.yincae.com or 518-452-2880.  We look forward to seeing you there.

A Cross-examiniation Of Underfill: YINCAE’s SMT 158 v. Three Standard Manufacturing Underfill Products

underfill-treeThe current trend of miniaturization in microelectronics have paved the way for 3D packaging; allowing for lower manufacturing cost, increased memory and speed and a greater variation in functional uses of the miniaturized devices. While miniaturization has afforded consumers with convenience and greater ease of use, manufacturers have been faced with problematic issues in light of the reduction of the standard bump size in 3D packaging from 80 µ to 10 µ.  Using nanoformulations, YINCAE Engineers have successfully crafted an array of solutions in response to issues that standard underfills have, particularly with flowability through the gaps between the bumps ≤ 10 µ.

In a recent study examining standard underfills for multilayer low bump 3D Packaging, YINCAE Advanced Material’s SMT 158 was compared against three other standard manufacturing underfill materials from leading suppliers. The results of this comparison are astounding. In reliability testing that included thermal cycling, flowability and pressure cooking, SMT 158 outperformed the other three materials in every stage of testing. Most noteworthy perhaps is that SMT 158 can flow up to 4  times faster than the other three.  The thermal cycling for the other three materials ranged from 800-1000 cycles before failure. SMT 158 did not fail until 3500 cycles, indicating a significance of reliability that far exceeds current industry standards.

With industry advancements using nanotechnology, the need to improve or completely eliminate undefill is imminent. YINCAE offers Advanced Material solutions that far exceeds the standard manufacturing protocol with smaller filler particulate and significantly faster curing underfill in addition to solder joint encapsulation adhesives that can be used in place of underfill at the same point in any reflow profile. Be sure to visit our web page www.yincae.com to learn more.

A Special Presentation by Dr. Wusheng Yin; An Overview of Advanced Materials


We at YINCAE Advanced Materials, LLC would like to cordially invite you to a special presentation, An Overview of Advanced Materials by Dr. Wusheng Yin; our President. YINCAE develops and manufactures a wide range of materials including:

  • Underfill Materials
  • Die Attach Adhesives
  • Conformal Coatings
  • Nano Composite Formulations
  • Wafer Level Materials
  • Optoelectronic Material
  • Thermal Interface Material
  • Solder Joint Encapsulation Adhesives (SJEA)

YINCAE offers a variety Adhesives, Thermal Interface, and Chip/ Board/ Packaging level materials for any level of necessity. Dr. Yin created the WORLD’s FIRST Lead -Free Solder Joint Encapsulation Adhesive solutions for wafer level, flip chip, POP, LGA, BGA and many more. YINCAE offers SJEA for low, medium, and high temperature solder alloy applications with differential chemistry and electrical/ thermal conductivity for your individualized needs.

 Date: Wednesday, May 27 2015

Time: 1:00pm-3:00 pm

Location:  Sheraton Hotel (4th Floor- Rooms 411/415) on-site of the ECTC 2015 Conference.

For more information or if you have any questions please feel free to contact the Administrative Office: www.yincae.com or 518-452-2880.  We look forward to seeing you there.


Tradeshows and Tradesecrets

IMAPS Ad Industry News.MicroelectronicsWe wont be giving away any Tradesecrets but we do have a busy month for Tradeshows! The month of May started with IMAPS New England. While our booth populated throughout the day, Dr. Yin, Founder and President of YINCAE Advanced Materials LLC gave a special presentation to attendees and exhibitors alike on YINCAE’s Low Temperature Solder Joint Encapsulation Adhesives. It is a hot topic in the Industry, since more often than not, reliability is challenged with the use of underfill. Dr. Yin and his team have hence developed a new alternative to underfill, improving the process and naturally improving the industry!

The evolution of soldering processes in the Microelectronics Industry has made a paradigm shift away from Sn/ Pb to Pb-free. Compounded with advancements in miniaturization, Pb- free soldering’s higher re-flow temperature and the nature of solder has resulted in poor reliability relative to: mechanical strength of the solder joint, warpage and thermal cycling performance. In response, YINCAE engineered low temperature solder joint encapsulation adhesives. This highly sophisticated Pb-free formula has been designed for mass production by dipping, printing or dispensing; replacing the traditional solder paste plus underfilling processes. Research examining the efficacy of this process evidences gains of 5-10x the strength of solder joints, surface homogeneity, thermal cycling performance and yield.

With the miniaturization of electronics, manufacturers have been presented with having to focus on finding solutions to weakening of various components. YINCAE offers a variety of Solder Joint Encapsulation Adhesive solutions for wafer level, flip chip, POP, LGA, BGA and many more. YINCAE offers SJEA for low, medium, and high temperature solder alloy applications with differential chemistry and electrical/ thermal conductivity for your individualized needs.

The reflow process of SJEA is in full alignment with typical solder paste reflow profiles and raises the bar on industry standards. Replacing high temperature reflow formulas with this level of sophistication, YINCAE’s SJEA provides a myriad of advantages including: the removal of bumps and metal oxides pads for surface homogeneity, better wetting, in-line curing and excellent stability at room temperature. With these advancements. YINCAE marks a new phase in industry growth, development and design for global leaders in technology.

If you didn’t get a chance to visit us at IMAPS New England, be sure to stop by our booth #815 at ECTC 2015 hosted by the Sheraton Hotel in San Diego Sunny California! Dr Yin will be sharing an special encore presentation of the myriad of solutions YINCAE offers. We look forward to seeing you there!