The semiconductor industry works continuously on making devices following Moore’s Law, which states that the density of components will double every two years. This miniaturization has caused devices to become less effective at dealing with heat. Traditional methods are no longer viable as they are incapable of providing the necessary heat transfer. YINCAE has developed thermal management products that can solve this issue.
Potential Solution Methods: Isolate certain devices from heat sources, improve heat transfer on thermally sensitive devices
YINCAE Solution: High thermally conductive and insulating die attach adhesives which also allow for a high strength adhesion, high reliability performance, and provides mechanical resistance.
DA90: Silver filled, thermally conductive, low temperature die attach adhesive
DA150: Silver filled, thermally conductive, high temperature die attach adhesive
DA90L: Highly thixotropic, low temperature insulating die attach adhesive
DA150LE: Thermosetting, high temperature insulating die attach adhesive
Potential Solution Method: Replace traditional conductive adhesives (Silver paste, SAC solder, and preform) with a material offering higher thermal conductivity
YINCAE Solution: Highly conductive solderable conduction adhesives along with reactive thermal greases can replace traditional products and lead to improved thermal dissipation, easier handling, and improved reliability.
TM150E: Solderable conductive adhesive
TGP110: High thermally conductive grease, no additional curing step required
Package Level Solutions
Potential Solution Method: Offer underfill materials which provide high heat dissipation
YINCAE Solution: Develop thermally conductive underfills which maintain current underfill properties including capillary flow, rapid flow, and are easy to rework.
SMT 158D: Diamond filled capillary flow underfill (TC > 5W/mK)
SMT 158A: Highly thermal conductive capillary flow underfill (TC ≈ 1 W/mK)
SMT 158FB7: Highly thermal conductive capillary and no flow underfill (TC = 2 W/mK)