Month: January 2017

PRESS RELEASE: New Product Announcement 

(Albany, NY) January 24, 2017 – BP 256 is YINCAE’s new ball attach adhesive product. BP 256 has been designed to enhance solder joint reliability and eliminate cleaning processes for LEAD-FREE ball bumping procedures on CSP, BGA, Flip chip, and PoP devices. It is compatible with current ball bumping processes. BP 256 is generally applied via printing or pin transfer methods and can replace traditional solder paste, flux, and underfill. During reflow, BP 256 encapsulates individual solder joints improving both reliability and drop test performance. This product also has the benefit of being 100% reworkable. BP 256 is commercially available, is currently being used for ball bumping applications. Additional information on the BP 256 is available by contacting YINCAE at info@yincae.com. If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

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Media Alert: Press Conference at IPC APEX EXPO 2017 Booth #823

Media Alert: Press Conference at IPC APEX EXPO 2017 BOOTH #823

 

Who Dr. Wusheng Yin is president of YINCAE Advanced Materials, LLC, a supplier of high performance coatings, adhesives and electronic materials, and a consultant of Howard University. Dr. Yin holds a Ph.D in polymer chemistry and physics from Institute of Chemistry, Academia Sinica. Dr. Yin has published over 100 journal articles and a few US patents in conducting polymers, organic/inorganic hybrid polymers, nanoparticles, adhesives, biomaterials and electronic materials.
What YINCAE to make major announcement concerning development of two groundbreaking adhesive materials for the electronics industry.
Where The Press Conference will be held on site, at the IPC APEX EXPO at the YINCAE booth #823.
When Tuesday, February 14th 2017 at 1:30 pm.
Why YINCAE has developed two new adhesives sure to revolutionize industry ball bumping and package level applications.
Contact Rebecca Wiley at Yincae_CS@yincae.com,

518-452-2880 (o) for scheduling questions.

ONE MONTH AWAY

IPC APEX EXPO 2017

VISIT YINCAE Booth # 823

 

(Albany, NY) 1/13/2017 –  IPC APEX EXPO 1 month away! The tradeshow will take place at San Diego Convention Center, in San Diego, CA., February 14-16, 2017. YINCAE hopes you will stop by our booth, which is in the North Hall, to learn more about YINCAE and the innovative products we have to offer.

 

YINCAE Advanced Materials, LLC hopes that you will join us at the conference to learn about YINCAE and the products that we have to offer. YINCAE has exclusive products that no other company has developed. YINCAE hopes to see you there at the conference. Please visit us at our booth # 823!

 

If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

 

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

###

The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.