Month: April 2017

We’re Going Places…


We are pleased to confirm that we will be exhibiting at SEMICON West in San Francisco, California on July 11th through the 13th. You will find our booth positioned in the NORTH HALL of the Moscone Center.

This year we will reside at booth # 5248. Feel free to stop by and say hi. Dr. Yin and our team have a wealth of knowledge in the SMT industry and would love to converse with you!

YINCAE Advanced Materials is a manufacturer of proprietary high performance adhesives, encapsulants and coatings for the electronics industry. Our products are focused on the central processor unit (CPU), providing new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices.

YINCAE adhesive products include: encapsulant, superfast cure adhesives for underfill replacement, solder joint encapsulant with eliminating underfilling process, solderable adhesives with high thermal and electrical conductivity for high power devices, optical adhesives for LCD, optoelectrical application, reactive thermal grease and thermal conductive adhesives.