YINCAE to Exhibit
SEMICON West Booth 5248 North Hall
(Albany, NY) 13 June 2017 – The SEMICON West 2017, North America’s premier Microelectronics event is less than a month away! SEMICON West 2017 will be held at the Moscone Center in San Francisco, CA from July 11th to 13th. YINCAE is pleased to exhibit in the NORTH HALL at booth 5248 where YINCAE is featuring two materials: SMT 256EP and BP 256.
BP 256 is YINCAE’s new ball attach adhesive product. BP 256 has been designed to enhance solder joint reliability and eliminate cleaning processes for LEAD-FREE ball bumping procedures on CSP, BGA, Flip chip, and PoP devices and is compatible with current SMT assembly processes. Also featured is SMT 256EP which replaces traditional solder paste, flux, and underfill. SMT 256EP enhances solder joint strength by 5 to 10 times and has demonstrated high pull strength at both room and high temperatures (280°C). At 280°C, SMT 256EP has a pull strength up to 180g. Thus, SMT 256EP eliminates the RTV or red glue that is typically used to hold components during double reflow, and reduces manufacturing costs.
YINCAE offers a variety of exclusive Adhesives, Thermal Interface, and Chip/Board/Packaging level materials that have been adopted by leading contract manufacturers and Tier 1 Microelectronic suppliers. Recipient of the 2015 Global Technology Award; YINCAE innovated the WORLD’s FIRST Lead-Free Solder Joint Encapsulation Adhesive solutions for wafer level, flip chip, POP, LGA, BGA and many more applications. YINCAE offers SJEA for low, medium, and high temperature solder alloy applications for your individualized needs.
If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit the company website by clicking the following link: YINCAE Website.