Month: August 2017

FAQ – Conformal Coatings

Questions about YINCAE Conformal Coatings?

We have the answers.

 

What are YINCAE UVC 88 Series conformal coating used for?

UVC 88F – designed for flexible substrates

UVC 88P – designed for rigid substrates

UVC 88G – biocompatible flexible hydrogel coating

UVC 88B – biocompatible flexible polymer coating

What are YINCAE EMC coatings used for?

EMC 25 and 25A are designed for protect surfaces from electromagnetic interference and improve surface conductivity.
What are YINCAE BF series coatings used for?

BF 90S and BF 150S are lid sealants designed to protect surfaces, such as: PCB, copper, ceramic, glass, or aluminum, from moisture, dust, chemicals and other harsh environmental conditions. BF 90S cures at 90°C while BF 150S cures at 150°C.

What is NCF 25 used for?

NCF 25 is an anti-oxidation solderable coating designed to prevent corrosion and rust on metal surfaces, including nickel, steel, aluminum…, and solderable surfaces.

 

Still have questions? Contact info@yincae.com

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SMTA International – 1 month away

SMTA International 2017

VISIT YINCAE BOOTH  329

Join Dr. Yin’s Presentation September 20th

 (Albany, NY) 8/15/2017 –  SMTA International will take place at the Donald Stephens Convention Center in Rosemont, IL.  September 17-21, 2017. YINCAE is scheduled to exhibit at booth # 329 September 19-20, 2017.

Dr. Wusheng Yin, the president of YINCAE Advanced Materials, is scheduled to speak at the technical conference. Dr. Yin will be presenting his white paper, “High Reliability and High Temperature Application Solution – Solder Joint Encapsulant Paste.” The presentation will be on held on Wednesday, September 20 at 9:00am in room 49.

 YINCAE Advanced Materials, LLC is pioneering the way with their unique solder joint encapsulants, underfill materials, die attach adhesives, wafer lever materials, optoelectronic materials, and conformal coatings.  YINCAE has exclusive products that no other company has developed. The exhibiting YINCAE team hopes to see you at the convention to learn more about the YINCAE brand and the state-of-the-art products offered.

To learn more about YINCAE, please visit the YINCAE team at booth # 329.

The YINCAE team has begun scheduling booth meetings for SMTAI. If you would like to speak with Dr. Yin or other members of the YINCAE team, please email info@yincae.com.

If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

High Reliability & High Throughput Ball Bumping Process Solution – Solder Joint Encapsulant Adhesive

Press Release
High Reliability & High Throughput Ball Bumping Process Solution – Solder Joint Encapsulant Adhesive

 (Albany, NY) August 14, 2017 – Dr. Wusheng Yin, YINCAE Advanced Materials LLC, will be discussing a new technology – solder joint encapsulant adhesives for ball bumping, at the 2017 International Symposium on Microelectronics in Raleigh, NC. Thursday, October 12, 2017, as a potential solution to the current limitations and challenges presented by miniaturization. As pitch and solder ball size continue to shrink, reliability begins to decline rapidly. Currently, the industry has adapted traditional methods such as capillary underfilling and corner or edge bonding. However, as miniaturization continues, even these methods are creating a bottleneck.

YINCAE has developed solder joint encapsulant adhesives for ball bumping applications to eliminate this bottleneck and allow miniaturization to continue while improving reliability, thermal cycling performance, drop test performance, and mechanical strength.

We welcome you to attend this speaker presentation on Thursday, October 12, 2017, and stop by our booth, 416, at iMAPS.

Additional information regarding Dr. Yin’s speaking session is available by contacting YINCAE at info@yincae.com.

If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

 

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.
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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

High Reliability & High Temperature Application Solution – Solder Joint Encapsulant Paste

High Reliability & High Temperature Application Solution – Solder Joint Encapsulant Paste

 

(Albany, NY) August 8, 2017 – Dr. Wusheng Yin, YINCAE Advanced Materials LLC, will be discussing a new technology – solder joint encapsulant paste for high temperature applications, at the 2017 SMTA International Conference in Rosemont, IL, as a potential solution to the current limitations and challenges presented by miniaturization. As miniaturization continues to be the driving force, the industry is beginning to face challenges associated with this trend including: warpage and reliability issues.

 

YINCAE has developed a solder joint encapsulant paste compatible with typical lead-free reflow profiles, but also has the ability to withstand high temperature applications (300°C). This paste also enhances solder joint strength, drop performance, and thermal cycling performance. As a result, using this paste can eliminate traditional underfill or corner bonding materials, as well as red glue, currently used for double sided reflow processes.

 

We welcome you to attend this speaker presentation and stop by our booth, 329, at SMTAI.

Additional information regarding Dr. Yin’s speaking session is available by contacting YINCAE at info@yincae.com.

 

If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.