Month: October 2017

FAQ – Die Attach Adhesives

Which die attach materials can be cured at low temperatures? DA90

YINCAE DA 90 series die attach adhesives

 

Which die attach materials can be cured quick?

Many YINCAE DA 150 series die attach adhesives cure within 15 minutes.

 

Does YINCAE provide both conductive and insulating die attach material options?

Yes, the DA 90 and DA 150 series consist of both insulating and conductive die attach materials.

 

What are the benefits of the DA 90 and DA 150 series die attach adhesives?

  1. Low temperature cure option
  2. Low temperature cure for high temperature applications (400°C)
  3. Low induced stresses
  4. Excellent mechanical resistance
  5. High reliability
  6. High temperature reflow

 

What are the YINCAE TM series products?

TM series products are highly conductive solderable adhesives and can replace conductive adhesives, such as silver paste, or solder materials.

 

What are the benefits of YINCAE TM series products?

  1. Higher thermal conductivity compared to pure solder alloy
  2. Lower process temperatures and high application temperatures
  3. Eliminates outgassing issues
  4. Eliminates cleaning processes
  5. Self-filling and Self-leveling
  6. Withstands harsh environments

 

Are the products shown on your die attach tree the only materials available in this category?

We have many more options. The products shown on the tree are our most popular materials. Please contact us if you are looking for a material with specific properties.

We also have a brochure with additional information regarding our die attach materials available on our website.

 

Is more information (i.e. TDS, additional material options, brochures…) regarding YINCAE die attach materials available?

Yes, please contact us using one of the links provided below. We also have a brochure available on our website.

 

Contact us for general questions

Contact us for technical inquiries

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FAQ – Solder Joint Encapsulants

bp256

What are solder joint encapsulant adhesives?

YINCAE solder joint encapsulant adhesives are epoxy based materials with a built-in flux function.

During reflow, solder joint encapsulant adhesives remove oxides allowing the solder joint to form, and encapsulate the solder joint in a 3D polymer network.

 

What are the benefits of solder joint encapsulant adhesives?

  1. Enhance solder joint strength
  2. Improve device reliability
  3. Eliminate underfill and the underfilling process
  4. Eliminate electrical issues (dendrites, electro-migration…)
  5. Eliminates cleaning processes
  6. Lower costs

 

How can solder joint encapsulant adhesives lower costs?

  1. 100 % reworkable – eliminate scrap cost
  2. Air reflowable – eliminate nitrogen cost
  3. Lower material usage
  4. Short manufacturing process – See comparison below
  5. High process yield

 

Underfill Process

underfill process

 

Solder Joint Encapsulant Process

SJE Process

 

 

Why is the reliability for solder joint encapsulant adhesives better than underfills?

Eliminate shrinkage factor generated by underfill (gap is filled with air when using solder joint encapsulants) – Less stress improves reliability

 

 

Can solder joint encapsulants help eliminate head – in – pillow issues?

Yes, solder joint encapsulant products provide additional mechanical strength to solder joints to help mitigate the impact of warpage.

 

 

Why can electro-migration issues be eliminated using YINCAE solder joint encapsulants?

Solder joint encapsulants encapsulate the solder joints after reflow to prevent dendrite formation.

 

 

What is BP 256?

BP 256 is a ball bumping adhesives designed to enhance solder joint strength during ball bumping processes

 

Advantages

  1. Increase throughput
  2. Improve reliability
  3. Eliminate additional cleaning steps
  4. Eliminate underfilling process in SMT production
  5. Reduce costs

 

Is there more information BP 256 available?

A brochure specifically for BP 256 with more detailed information and reliability data is located on our website.

 

Is more information (i.e. TDS, additional material options…) for YINCAE solder joint encapsulant products available?

Yes, please contact us using one the links provided below.

 

Contact us for general questions

Contact us for technical inquiries