Which underfill materials are designed for board level applications?
YINCAE SMT 88 series underfills and SMT 158UL
Which underfill materials are designed for package level applications?
YINCAE SMT 158 and SMT 158HA series capillary underfills
Which underfill materials are designed for wafer level applications?
YINCAE WL 125 series wafer level underfills
What are the benefits of YINCAE SMT 158 series underfills?
- Nano underfill
- Fast cure option
- No resin bleeding
- Full compatibility with lead-free processes
- Good for narrow gap underfilling
- High reliability
What are the benefits of YINCAE SMT 88 series underfills?
- Room temperature underfilling
- Fast flow
- Fast low temperature cure
- High reliability
- Friendly storage conditions
- Easy rework
Does YINCAE offer thermally conductive underfill materials?
Yes, YINCAE offers three thermally conductive underfill materials
- SMT 158A
- SMT 158D – Diamond filled
- SMT 158FB7
Does YINCAE offer underfills designed for specific applications (i.e. thermal management, capillary, non-flow…)?
Yes, YINCAE offers a wide range of underfills including:
- Board level capillary underfill
- Package level capillary underfill
- Non-flow underfill
- Reflowable underfill
- Thermal underfill
Does YINCAE offer underfills with a wide range of options (C.T.E, color, viscosity…)?
Yes, contact us with material requirements and we can send product information.
Does YINCAE offer permanent underfills?
Yes, our SMT 158 and SMT 158HA series underfills are permanent
Does YINCAE offer reworkable underfills?
Yes, our SMT 88 series underfills and SMT 158UL, are reworkable
Is more information (i.e. TDS, additional material options, brochures…) regarding YINCAE underfill materials available?
Yes, please contact us using one of the links provided below. We also have a brochure available on our website.