Month: December 2017

DA 150 High Temperature, Fast Cure Die Attach Adhesive Series Materials

(Albany, NY) December 22, 2017 – The DA 150 series materials are YINCAE’s new fast curing die attach adhesives. The DA 150 series offers conductive and insulating options to suit a large variety of applications. These products can be cured quickly at 150°C and offers outstanding electrical conductivity. In addition to these two major benefits, the DA 150 series materials also offers no delamination, high reliability, and high thermal conductivity. DA 150 series die attach adhesive materials are commercially available and are currently being used for insulating and conductive die attach applications.

Additional information regarding DA 150 products is available by contacting YINCAE at info@yincae.com.

If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us at www.yincae.com.

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

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IPC APEX 2018 is 2 months away! Visit YINCAE at Booth 2732

(Albany, NY) 12/04/2017 – IPC APEX EXPO is nearly two months away! The trade show will take place at the San Diego Convention Center, in San Diego, CA, from February 27th to March 1st, 2018. YINCAE hopes you will stop by our booth # 2732, to learn more about YINCAE and the innovative products we have to offer.

YINCAE Advanced Materials offers innovative and premier products including: adhesives, thermal interface materials (TIM1/TIM2), board/package/wafer level materials, and coatings; many of which have been implemented by leading semiconductor manufacturers and Tier 1 microelectronic suppliers. YINCAE continues to exceed customer expectations and develop solutions for flip chip, CSP, BGA, POP, LGA, and many more applications. YINCAE hopes to see at the exhibition!

To schedule a meeting with the YINCAE team during the exhibition, please email us at: info@yincae.com with a brief description of the meeting topic. You can also find more information by visiting our website at: www.yincae.com

 

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.