Month: January 2018

DA 150 High Temperature, Fast Cure Die Attach Adhesive Series Materials

Press Release

DA 150 High Temperature, Fast Cure Die Attach Adhesive Series Materials

(Albany, NY) December 22, 2017 – The DA 150 series materials are YINCAE’s new fast curing die attach adhesives. The DA 150 series offers conductive and insulating options to suit a large variety of applications. These products can be cured quickly at 150°C and offers outstanding electrical conductivity. In addition to these two major benefits, the DA 150 series materials also offers no delamination, high reliability, and high thermal conductivity. DA 150 series die attach adhesive materials are commercially available and are currently being used for insulating and conductive die attach applications.

Additional information regarding DA 150 products is available by contacting YINCAE at info@yincae.com.

If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us at http://www.yincae.com.

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.
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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

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YINCAE’S New Reflowable Underfill Material: SMT 160

Press Release

YINCAE’S New Reflowable Underfill Material: SMT 160

(Albany, NY) 1/2/2018 – YINCAE Advanced Materials has recently developed a reflowable (no flow) underfill: SMT 160. This product is designed to eliminate capillary underfills, simplify the assembly process, combine soldering and underfilling in SMT processes, increase throughput, and reduce costs.

Reflowable underfills are dispensed or printed onto the board before component placement occurs. The design of these materials allow it to stay in place and not flow away from the designated areas, allowing component placement to occur in a subsequent step.

YINCAE offers one unfilled reflowable underfill material: SMT 160. This underfill provides high reliability, has a built-in flux function, and can eliminate voids. This material has also been designed to be applied through dipping, dispense, or printing methods, giving the design engineer greater flexibility.

For more information on YINCAE’s reflowable underfill: SMT 160, or to learn more about what YINCAE offers, please email us at: info@yincae.com. You can also find more information by visiting our website at: http://www.yincae.com

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.
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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

Low Temperature Reflowable Underfill Material: SMT 160L

Press Release

Low Temperature Reflowable Underfill Material: SMT 160L

(Albany, NY) 1/3/2018 – YINCAE Advanced Materials has recently developed a low temperature curable reflowable (no flow) underfill: SMT 160L. This product is designed to eliminate capillary underfills, simplify the assembly process, combine soldering and underfilling in SMT processes, increase throughput, and reduce costs.

Reflowable underfills are dispensed or printed onto the board before component placement occurs. The design of these materials allow it to stay in place and not flow away from the designated areas, allowing component placement to occur in a subsequent step.

YINCAE offers a low temperature curable unfilled reflowable underfill material: SMT 160L. This underfill provides high reliability, has a built-in flux function, cures at 140 – 170°C, and can eliminate voids. This material has also been designed to be applied through dipping, dispense, or printing methods, giving the design engineer greater flexibility.

For more information on YINCAE’s reflowable underfill: SMT 160L, or to learn more about what YINCAE offers, please email us at: info@yincae.com. You can also find more information by visiting our website at: http://www.yincae.com

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.
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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

IPC APEX 2018 is 1 month away! Visit YINCAE at Booth 2732

(Albany, NY) 1/8/2018 – IPC APEX EXPO is almost one month away! The trade show will take place at the San Diego Convention Center, in San Diego, CA, from February 27th to March 1st, 2018. YINCAE hopes you will stop by our booth # 2732, to learn more about YINCAE and the innovative products we have to offer.

YINCAE Advanced Materials offers innovative and premier products including: adhesives, thermal interface materials (TIM1/TIM2), board/package/wafer level materials, and coatings; many of which have been implemented by leading semiconductor manufacturers and Tier 1 microelectronic suppliers. YINCAE continues to exceed customer expectations and develop solutions for flip chip, CSP, BGA, POP, LGA, and many more applications. YINCAE hopes to see you at the exhibition!

To schedule a meeting with the YINCAE team during the exhibition, please email us at: info@yincae.com with a brief description of the meeting topic. You can also find more information by visiting our website at: www.yincae.com

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.