Month: February 2018

Press Release: YINCAE’S New High Purity Liquid Encapsulant: SMT 158HA

Press Release

YINCAE’S New High Purity Liquid Encapsulant: SMT 158HA

(Albany, NY) February 14, 2018 – YINCAE Advanced Materials has recently developed a unique amine based high purity liquid epoxy encapsulant: SMT 158HA. SMT 158HA is a slow cure underfill particularly designed for large components with small bumps and for applications with strict environmental regulations.

SMT 158HA has been particularly designed to be used for large component applications as it is highly viscous and allows air to easily escape from the gap during the underfilling process. The slow cure process allows air bubbles to migrate to the edge and escape. Though these processes generally do not significantly impact most components, they require more time to complete for large chips, and the design of SMT 158HA creates the conditions to lead to a void free underfill. As a result, components will exhibit lower thermal stress, and thus improved reliability for devices.

In additional to numerous processing benefits, SMT 158HA also offers many material benefits. SMT 158HA has a low CTE (20 ppm/K), a high glass transition temperature (156°C), is fast flowing, and offers a high adhesion strength.

For more information on YINCAE’s SMT 158HA underfill, or to learn more about what YINCAE offers, please email us at: info@yincae.com. You can also find more information by visiting our website at: http://www.yincae.com

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.
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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

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Press Release: DA 90 Low Temperature Die Attach Adhesive Series Materials

Press Release
DA 90 Low Temperature Die Attach Adhesive Series Materials

(Albany, NY) February 14, 2018 – The DA 90 series materials are YINCAE’s new low temperature die attach adhesives. The DA 90 series offers conductive and insulating options to suit a large variety of applications. These products can be cured at low temperatures (82 – 90°C) and can be used for high temperature applications (215°C for 15 years). In addition to low temperature curing, these products also offer no delamination, high reliability, and high thermal and electrical conductivity. DA 90 series die attach adhesive materials are commercially available and are currently being used for insulating and conductive die attach applications.

Additional information regarding DA 90 products is available by contacting YINCAE at info@yincae.com.

If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.
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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

Press Release IPC APEX 2018 is 2 Weeks Away! Visit YINCAE at Booth 2732

(Albany, NY) 2/6/2018 – IPC APEX EXPO is just two weeks away! The trade show will take place at the San Diego Convention Center, in San Diego, CA, from February 27th to March 1st, 2018. YINCAE hopes you will stop by our booth # 2732, to learn more about YINCAE and the innovative products we have to offer.

YINCAE Advanced Materials offers innovative and premier products including: adhesives, thermal interface materials (TIM1/TIM2), board/package/wafer level materials, and coatings; many of which have been implemented by leading semiconductor manufacturers and Tier 1 microelectronic suppliers. YINCAE continues to exceed customer expectations and develop solutions for flip chip, CSP, BGA, POP, LGA, and many more applications. YINCAE hopes to see you at the exhibition!

To schedule a meeting with the YINCAE team during the exhibition, please email us at: info@yincae.com with a brief description of the meeting topic. You can also find more information by visiting our website at: http://www.yincae.com

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.
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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.