(Albany, NY) 3/30/2018 – SEMICON West is nearly 3 months away! The tradeshow will take place at the Moscone Center, in San Francisco, CA, from July 10 thru 12, 2018. YINCAE hopes you will stop by our booth #5269, to learn more about YINCAE and the innovative products we have to offer.
YINCAE offers a variety of exclusive materials such as thermal interface and chip/board/packaging level material, die attach adhesives and underfill that have been adopted by leading contract manufacturers and tier 1 microelectronic suppliers, and we are excited to be showcasing some or our most popular products at SEMICON West. YINCAE innovated the world’s first lead-free solder joint encapsulation adhesive solution for wafer level, flip chip, POP, LGA, BGA and many other applications. YINCAE offers SJEA for low, medium and high temperature solder alloy applications for your unique applications.
To schedule a meeting with the YINCAE team during the exhibition, please email us at: firstname.lastname@example.org with a brief description of the meeting topic. You can also find more information about our products by visiting our website at: www.yincae.com
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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.
The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.