Month: May 2018

YINCAE’S SMT 158A Receives High Praise

As chips and packages become more complex, and installed in harsher conditions such as automobiles, the thermal conductivity of underfill materials becomes a greater concern. What can be done to prevent decreased reliability due to thermal dissipation issues?

The solution: SMT 158A.

SMT 158A has a thermal conductivity of 2 W/mK, at least four times  that of conventional underfill materials filled with silicon dioxide. As chips and packages become more complex, and are installed in harsh environments, underfill thermal conductivity becomes an important consideration. An underfill with a high thermal conductivity, such as SMT 158A, reduces heat build up and increases chip reliability. SMT 158A was described by a customer as having a thermal conductivity that is “better than any other UF materials from leading UF suppliers”.

SMT 158A is a highly thermally conductive, rapid curing, fast flowing and easily reworked liquid epoxy that can be used for flip chips, chip scale packages, ball grid array devices, package and land grid array applications.  It is also suitable for bare chip protection in a variety of advanced packages such as memory cards, chip carriers, hybrid circuits and multi-chip modules.

SMT 158A has been designed for a high production environment where process speed and mechanical shock are the key concerns.  It is easily dispensed, minimizes induced stresses and provides outstanding reliability performance (e.g., temperature cycling performance) and excellent mechanical resistance.

For more information on YINCAE’s SMT 158A underfill, or to learn more about the YINCAE product range, please email us at: info@yincae.com. You can also find more information by visiting our website at: www.yincae.com

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

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YINCAE’S New Highly Conductive Thermal Underfill: SMT 158D

(Albany, NY) May 11, 2018: YINCAE Advanced Materials is proud to introduce SMT 158D, the world’s first (and only) diamond filled underfill!

SMT 158D was developed in response to the need for underfill materials with a higher thermal conductivity. The thermal conductivity of SMT 158D is 6W/mK, compared to the thermal conductivity of traditional silicon dioxide filled underfill which has a thermal conductivity of less than 1W/mK. Increased thermal conductivity improves reliability in a variety of devices, and is ideal for packages where heat build up is a concern.

SMT 158D is a diamond filled, rapid curing, fast flowing and easily reworked liquid epoxy that can be used for flip chips, chip scale packages, ball grid array devices, package and land grid array applications.  It is also suitable for bare chip protection in a variety of advanced packages such as memory cards, chip carriers, hybrid circuits and multi-chip modules.

SMT 158D has been designed for a high production environment where process speed, thermal issues, and reliability are the key concerns.  This material is easily dispensed, minimizes induced stresses and provides outstanding reliability performance (e.g., temperature cycling performance) and excellent mechanical resistance.

For more information on YINCAE’s SMT 158D underfill, or to learn more about the YINCAE product range, please email us at: info@yincae.com. You can also find more information by visiting our website at: www.yincae.com

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

SEMICON WEST 2018 IS 2 MONTHS AWAY!

(Albany, NY) 5/7/2018 –  SEMICON WEST 2018 is 2 months away! The tradeshow will take place at the Moscone Center in San Francisco, California, July 10 to 12. YINCAE hopes you will stop by our Booth 5269 to learn more about YINCAE and the innovative products we have to offer.

Dr. Yin and the team are eager to reconvene with our longtime clients and to make new connections as well. The YINCAE staff wants to hear about your latest work and to tell you about ours. In a consultative approach, our team helps clients identify material and application issues and can recommend appropriate product solutions.

YINCAE Advanced Materials hopes that you will join us at the conference to learn more. YINCAE has exclusive products that no other company has developed and can tailor materials to meet your project needs. YINCAE is unique in that we combine the quality and service of a small company with the production capability of a larger corporation.

If you would like to schedule a meeting with the YINCAE team, please reach out to us at info@yincae.com. You can also get more information by visiting our website through the following link: www.yincae.com.

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, package level, board level and final devices while facilitating smarter and faster production and supporting green initiatives.

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.