We hope to see you at SEMICON West 2018 this year! YINCAE will be exhibiting at booth #5269 in the north hall of the Moscone Center, and would like to invite you to discuss your latest work and our latest innovations, including…
· World’s first commercial diamond underfill: SMT 158D series.
· High filler-load underfill; flows into small gaps at room temperature: SMT 158UL series.
· Solder joint encapsulant paste; low temperature reflow and high pull strength at high temperature (300℃): SMT 256EP.
· Reflowable (filled) underfill; excellent for micro-bump wafer-level application: SMT 158R and 160 series.
· Mold underfill; 90% filler load, able to flow into 25μm gap: MUF 158 series.
If you would like to learn more about these products, please let us know your availability for a booth meeting with us at SEMICON WEST. We are also available for on-site meetings or WebEx conference calls if you will not be attending this year’s show visit YINCAE.com!SEMIWEST_1MONTH_PR