(Albany, NY) 12/31/2018 – YINCAE is proud to announce that we will be attending the iMAPS New England 46th Symposium and Expo at the Boxboro Regency Hotel in Boxborough, MA. The Annual New England Symposium & Expo is widely regarded as a regional convention held for the largest and most prestigious companies in the microelectronics industry.
YINCAE offers a wide range of products tailored to solve problems as well as increase efficiency—two key components that make our products unique. This year YINCAE Advanced Materials offers premier products including our Solder joint encapsulant paste which can provide lower temperature soldering and be used at a higher temperature (300⁰c). Our 50% filler nano-underfill can flow fast into small gaps (10m) at room temperature while our high-end underfills are fully compatible with flux residue and has zero gassing. We also offer Die Attach materials as well as Diamond Underfills. YINCAE continues to exceed customer expectations and develop specialized solutions for not only flip chip, CSP, BGA, POP, LGA, but also many more applications. You can also find more information on our website at: http://www.yincae.com.
We hope to see you at iMAPS Symposium!