Author: yincae

1 MONTH AWAY FOR SEMICON WEST 2018!!!!

(Albany, NY) 6/12/2018 – SEMICON WEST 2018 is just 1 month away! The tradeshow will take
place at the Moscone Center in San Francisco, California, July 10 to 12. YINCAE hopes you will
stop by our Booth 5269 to learn more about YINCAE and the innovative products we have to
offer.
YINCAE has a wide range of materials varying from the World’s first commercial diamond
underfill, to a high filler-load underfill that have the ability to flow into small gaps at room
temperature, a solder joint encapsulant paste that has low temperature reflow and high pull strength
at high temperature (300℃), a reflowable (filled) underfill that is excellent for micro-bump wafer
level and last but not least, a mold underfill with a 90% filler load able to flow into 25μm gap
without external force.
YINCAE team are eager to reconvene with our longtime clients and to make new connections as
well. The YINCAE staff wants to hear about your latest work and to tell you about ours. In a
consultative approach, our team helps clients identify material and application issues and then
recommend appropriate product solutions.
YINCAE Advanced Materials hopes that you will join us at the conference to learn more. YINCAE
has exclusive products that no other company has developed and can tailor materials to meet your
project needs.
If you would like to schedule a meeting with the YINCAE team, please reach out to us at
info@yincae.com. You can also get more information by visiting our website through the
following link: http://www.yincae.com.
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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer
and supplier of high-performance coatings, adhesives and electronic materials used in the microchip &
optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer
level, package level, board level and final devices while facilitating smarter and faster production and supporting
green initiatives.
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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.UnderfillTreePoster3

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SEMICON WEST 2018; 5 reasons to visit YINCAE booth 5269!:

We hope to see you at SEMICON West 2018 this year! YINCAE will be exhibiting at booth #5269 in the north hall of the Moscone Center, and would like to invite you to discuss your latest work and our latest innovations, including…

· World’s first commercial diamond underfill: SMT 158D series.
· High filler-load underfill; flows into small gaps at room temperature: SMT 158UL series.
· Solder joint encapsulant paste; low temperature reflow and high pull strength at high temperature (300℃): SMT 256EP.
· Reflowable (filled) underfill; excellent for micro-bump wafer-level application: SMT 158R and 160 series.
· Mold underfill; 90% filler load, able to flow into 25μm gap: MUF 158 series.

If you would like to learn more about these products, please let us know your availability for a booth meeting with us at SEMICON WEST. We are also available for on-site meetings or WebEx conference calls if you will not be attending this year’s show visit YINCAE.com!SEMIWEST_1MONTH_PR

SEMICON WEST 2018 is in 1 Month! VISIT YINCAE BOOTH 5269

(Albany, NY) 6/12/2018 SEMICON WEST 2018 is just 1 month away! The tradeshow will take place at the Moscone Center in San Francisco, California, July 10 to 12. YINCAE hopes you will stop by our Booth 5269to learn more about YINCAE and the innovative products we have to ofer.
Dr. Yin and the team are eager to reconvene with our longtime clients and to make new connections as well. The YINCAE staff wants to hear about your latest work and to tell you about ours. In a consultative approach, our team helps clients identify material and application issues and then recommend appropriate product solutions.
YINCAE Advanced Materials hopes that you will join us at the conference to learn more. YINCAE has exclusive products that no other company has developed and can tailor materials to meet your project needs.
If you would like to schedule a meeting with the YINCAE team, please reach out to us at
info@yincae.com. You can also get more information by visiting our website through the
following link: www.yincae.com.

YINCAE’S SMT 158A Receives High Praise

As chips and packages become more complex, and installed in harsher conditions such as automobiles, the thermal conductivity of underfill materials becomes a greater concern. What can be done to prevent decreased reliability due to thermal dissipation issues?

The solution: SMT 158A.

SMT 158A has a thermal conductivity of 2 W/mK, at least four times  that of conventional underfill materials filled with silicon dioxide. As chips and packages become more complex, and are installed in harsh environments, underfill thermal conductivity becomes an important consideration. An underfill with a high thermal conductivity, such as SMT 158A, reduces heat build up and increases chip reliability. SMT 158A was described by a customer as having a thermal conductivity that is “better than any other UF materials from leading UF suppliers”.

SMT 158A is a highly thermally conductive, rapid curing, fast flowing and easily reworked liquid epoxy that can be used for flip chips, chip scale packages, ball grid array devices, package and land grid array applications.  It is also suitable for bare chip protection in a variety of advanced packages such as memory cards, chip carriers, hybrid circuits and multi-chip modules.

SMT 158A has been designed for a high production environment where process speed and mechanical shock are the key concerns.  It is easily dispensed, minimizes induced stresses and provides outstanding reliability performance (e.g., temperature cycling performance) and excellent mechanical resistance.

For more information on YINCAE’s SMT 158A underfill, or to learn more about the YINCAE product range, please email us at: info@yincae.com. You can also find more information by visiting our website at: www.yincae.com

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

YINCAE’S New Highly Conductive Thermal Underfill: SMT 158D

(Albany, NY) May 11, 2018: YINCAE Advanced Materials is proud to introduce SMT 158D, the world’s first (and only) diamond filled underfill!

SMT 158D was developed in response to the need for underfill materials with a higher thermal conductivity. The thermal conductivity of SMT 158D is 6W/mK, compared to the thermal conductivity of traditional silicon dioxide filled underfill which has a thermal conductivity of less than 1W/mK. Increased thermal conductivity improves reliability in a variety of devices, and is ideal for packages where heat build up is a concern.

SMT 158D is a diamond filled, rapid curing, fast flowing and easily reworked liquid epoxy that can be used for flip chips, chip scale packages, ball grid array devices, package and land grid array applications.  It is also suitable for bare chip protection in a variety of advanced packages such as memory cards, chip carriers, hybrid circuits and multi-chip modules.

SMT 158D has been designed for a high production environment where process speed, thermal issues, and reliability are the key concerns.  This material is easily dispensed, minimizes induced stresses and provides outstanding reliability performance (e.g., temperature cycling performance) and excellent mechanical resistance.

For more information on YINCAE’s SMT 158D underfill, or to learn more about the YINCAE product range, please email us at: info@yincae.com. You can also find more information by visiting our website at: www.yincae.com

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

SEMICON WEST 2018 IS 2 MONTHS AWAY!

(Albany, NY) 5/7/2018 –  SEMICON WEST 2018 is 2 months away! The tradeshow will take place at the Moscone Center in San Francisco, California, July 10 to 12. YINCAE hopes you will stop by our Booth 5269 to learn more about YINCAE and the innovative products we have to offer.

Dr. Yin and the team are eager to reconvene with our longtime clients and to make new connections as well. The YINCAE staff wants to hear about your latest work and to tell you about ours. In a consultative approach, our team helps clients identify material and application issues and can recommend appropriate product solutions.

YINCAE Advanced Materials hopes that you will join us at the conference to learn more. YINCAE has exclusive products that no other company has developed and can tailor materials to meet your project needs. YINCAE is unique in that we combine the quality and service of a small company with the production capability of a larger corporation.

If you would like to schedule a meeting with the YINCAE team, please reach out to us at info@yincae.com. You can also get more information by visiting our website through the following link: www.yincae.com.

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, package level, board level and final devices while facilitating smarter and faster production and supporting green initiatives.

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

An Innovation Reliability Solution to Interconnect of Flexible/Rigid Substrates

(Albany, NY)– Miniaturization is a trend in the electronic industry, which has increasingly attracted more attention. However, the manufacturing process and reliability have become more and more challenging due to miniaturization. The main issues that miniaturization present are the strength of solder joints, decreasing thermal cycling performance, and product reworkability.

Increasing miniaturization in the electronic industry is a trend that can clearly be seen as time continues to move forward. The strength of solder joint or interconnects presents a challenging issue as it becomes more difficult to meet customers’ requirements. Underfilling the interconnects of rigid/flexible substrates does not solve the problem. SMT 266 – Solder joint encapsulant adhesive provides a reliable solution to the interconnect of rigid/flexible substrates. Using solder joint encapsulant adhesive not only doubles the strength of the interconnect compared to using traditional flux, but also ensures 100% manufacturing process yield. SMT 266 is used in line process, thus shortening the manufacturing process. The SMT 266 solder joint encapsulant adhesive provides a solution to all problems that miniaturization can cause.

Additional information regarding SMT 266 is available by contacting YINCAE at info@yincae.com.

If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.