Author: yincae

YINCAE’s New NC 256 Zero Residue Flux

(Albany, NY) August 19, 2019 YINCAE is excited to announce that we have successfully developed a new No Clean Flux product –NC 256 with zero flux residue, excellent soldering wetting and eliminates the cleaning process.  NC 256 has been designed not only for wafer ball bumping and other ball bumping such as CSP, BGA, Flip chip and PoP (package on package), particularly for lead free applications, but also for flip chip, CSP, BGA and other advanced components attachment to eliminate cleaning process. During reflow there is no contamination on solder ball or the neighboring component. NC 256 can be screen or stencil printed, or dispensed onto the pads of component foot print or dipped onto solder ball of the components.

 

Using NC 256 can eliminate the cleaning process and is fully compatible with underfill.  To avoid the contamination from underfill, YINCAE SMT 158HA is recommended with NC 256 together because SMT 158HA has zero outgassing.  Using NC 256 and SMT 158HA together can eliminate cleaning completely.  NC 256 can be used for mass reflow process or rework process.

 

 

Additional information on the NC 256 is available by contacting YINCAE at info@yincae.com.

 

If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC

YINCAE Advanced Materials, LLC. Proudly Announces ISO 9001:2015 Certification

(Albany, NY) July 16, 2019 We’re proud to announce that YINCAE has received its official ISO 9001:2015 certification! This certification is a testament of YINCAE’s commitment to customer satisfaction, quality, and continuous improvement. ISO 9001 is a quality management system standard that was developed by the International Organization for Standardization, an association of governmental and nongovernmental organizations from many countries. The ISO 9001 standard is utilized to certify quality management systems that focus on continuous improvement, customer satisfaction and the active involvement of both management and employees in a process based approach. “I could not be happier with the performance everyone at YINCAE has shown throughout the ISO 9001:2015 certification process,” said Dr. Wusheng Yin, CEO of YINCAE. “This certification has demonstrated our clear desire to always operate at the highest levels of quality and efficiency. This is not just recognition of our tireless efforts to put the best products and service available on the market but that we intend to do so in the future!” YINCAE anticipates that the ISO 9001:2015 certification will help the company:

• Provide quality products to meet or exceed customer’s needs, expectations and requirements

• Build an organization culture to focus on continual improvement and innovation

• Produce products that comply with relevant laws and regulations

• Ensure reliable risk management using best preventive practices

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.
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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

YINCAE Advanced Materials to Exhibit and Present at IMAPS 2019 Boston 52nd International Symposium on Microelectronics

(Albany, NY) July 15, 2019 YINCAE Advanced Materials is proud to announce that we will be exhibiting at this year’s IMAPS 2019 Boston 52nd International Symposium on Microelectronics, at the Hynes Convention Center, in Boston, MA on October 1 – 2, 2019.

The International Microelectronics Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education.

YINCAE offers a variety of exclusive materials such as thermal interface and wafer-level /packaging level/board level materials, die attach adhesives and underfill that have been adopted by leading contract manufacturers and tier 1 microelectronic customers, and we are excited to be showcasing some or our most popular products at iMAPS 52nd International Symposium on Microelectronics. YINCAE innovated the world’s first lead-free solder joint encapsulation adhesive solution for wafer level, flip chip, POP, LGA, BGA and many other applications. YINCAE offers SJEA for low, medium and high temperature solder alloy applications for your unique applications. YINCAE underfills not only offer high thermal conductivity and high Tg ( 245C) but also can be used at over 400C.

To schedule a meeting with the YINCAE team during the Symposium, please email us at: yincae_cs@yincae.com with a brief description of the meeting topic. You can also find more information about our products by visiting our website at: http://www.yincae.com

We are looking forward to seeing you at this symposium! We produce cutting-edge products that are unique to the semiconductor industry. We will be available at our booth to talk about our products and answer any questions you may have.

For more information or if you have any questions, please feel free to visit our website at: http://www.yincae.com or give us a call at 518-452-2880. We look forward to seeing you there.

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Founded and headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives, and electronic materials used in microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

YINCAE at iMAPS New England

(Albany, NY) 12/31/2018 – YINCAE is proud to announce that we will be attending the iMAPS New England 46th Symposium and Expo at the Boxboro Regency Hotel in Boxborough, MA. The Annual New England Symposium & Expo is widely regarded as a regional convention held for the largest and most prestigious companies in the microelectronics industry.

YINCAE offers a wide range of products tailored to solve problems as well as increase efficiency—two key components that make our products unique. This year YINCAE Advanced Materials offers premier products including our Solder joint encapsulant paste which can provide lower temperature soldering and be used at a higher temperature (300⁰c). Our 50% filler nano-underfill can flow fast into small gaps (10m) at room temperature while our high-end underfills are fully compatible with flux residue and has zero gassing. We also offer Die Attach materials as well as Diamond Underfills. YINCAE continues to exceed customer expectations and develop specialized solutions for not only flip chip, CSP, BGA, POP, LGA, but also many more applications. You can also find more information on our website at: http://www.yincae.com.

We hope to see you at iMAPS Symposium!

YINCAE at iMAPS 2019- Boston

(Albany, NY) 12/31/2018 – YINCAE will be attending the 52nd Symposium on Microelectronics in Boston, MA from October 1-3, 2019 held at the Hynes Convention Center. We invite you to attend and visit our booth to learn what new and innovative products we have to offer this year.

This year YINCAE Advanced Materials offers premier products including our Solder joint encapsulant paste which can provide lower temperature soldering and be used at a higher temperature (300⁰c). Our 50% filler nano-underfill can flow fast into small gaps (10m) at room temperature while our high-end underfills are fully compatible with flux residue and has zero gassing. We also offer Die Attach materials as well as Diamond Underfills. YINCAE continues to exceed customer expectations and develop specialized solutions for not only flip chip, CSP,

BGA, POP, LGA, but also many more applications. We hope you take this opportunity to visit us at iMAPS where our experts will not only provide a unique perspective to your needs but also provide immediate product recommendations that are guaranteed to create a solution and improve efficiency.

For more information about our products and services, please visit our website at: www.yincae.com. We hope to see you at iMAPS 2019!

YINCAE at IPC APEX EXPO 2019

                                               IPC APEX 2019 is 1 month away! 

(Albany, NY) 12/28/2018 – The IPC APEX 2019 trade show will take place at the San Diego Convention Center, in San Diego, CA, from January 29-31, 2019. Our team will be showcasing our wide range of specialized products as well as create solutions of your manufacturing needs. We hope to see you at Booth #1720 in North Hall, to learn more about YINCAE and these innovative products we have to offer.

This year YINCAE Advanced Materials offers premier products including our Solder joint encapsulant paste which can provide lower temperature soldering and be used at a higher temperature (300⁰c). Our 50% filler nano-underfill can flow fast into small gaps (10m) at room temperature while our high-end underfills are fully compatible with flux residue and has zero gassing. We also offer Die Attach materials as well as Diamond Underfills. YINCAE continues to exceed customer expectations and develop specialized solutions for not only flip chip, CSP, BGA, POP, LGA, but also many more applications.

To schedule a meeting with the YINCAE team during the exhibition, please email us at: info@yincae.com with a brief description of the meeting topic and we will gladly reserve a time to see you. You can also find more information by visiting our website at: www.yincae.com. We hope to see you at the exhibition!

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.