Author: yincae

YINCAE’s New Underfill with Zero Outgassing: SMT 158HA

(Albany, NY) September 4, 2018 YINCAE is excited to announce that we have developed SMT 158HA, an underfill with zero outgassing that is fully compatible with flux material.

Due to its unique properties, SMT 158HA completely eliminates the cleaning process both after reflow and after curing. Zero outgassing means that there is no weight loss during curing therefore nearby solder balls and other components do not become contaminated. Also, the flux residue does not need to be removed before SMT 158HA is applied.

SMT 158HA was initially developed for high temperature applications, and can withstand temperatures of up to 400ºC. It also withstands up to 5x reflow.

This material can be used for flip chip, wafer-level chip scale package application. It is also suitable for bare chip protection in a variety of advanced packages such as memory cards, chip carriers, hybrid circuits and multi-chip modules. It is designed for high production and friendly environment where process speed and mechanical shock are key concerns.

For more information on YINCAE’s SMT 158HA underfill, or to learn more about the YINCAE product range, please email us at: info@yincae.com. You can also find more information by visiting our website at: www.yincae.com

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

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YINCAE at IWLPC 2018

(Albany, NY) July 16, 2018: YINCAE is excited to announce that we will be attending the 15th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition in San Jose, CA this year from October 23rd-25th at the Double Tree by Hilton. This conference brings together many of the top performers in the semiconductor industry and addresses all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing.

 

As we prepare for the upcoming event, we hope that you are looking to attend the show as well. Come by our Booth 47 and take one of our informative pamphlets, learn more about the array of products we supply, and ask us any questions that you may have. YINCAE hopes that you will be attending the show and stop by to learn more about our company and the innovative products that we have to offer!

 

YINCAE has unique and exclusive products that no other company has developed. There is a lot that can be taken away from not only our booth and products, but from the IWLPC 2018 as a whole. YINCAE hopes to see you there at the IWLPC 2018 at Booth 47!

 

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

SEMICON WEST 2018 starts next Tue July 10th! VISIT YINCAE BOOTH 5269

(Albany, NY) July 3, 2018 – SEMICON West 2018, North America’s premier Microelectronics event, is just one week away! The show will be held at the Moscone Center in San Francisco, CA from July 10th to 12th. YINCAE sincerely invites you to stop by our Booth #5269 to speak with our experts and to see what’s new.
We are noticing an emerging trend in underfill and thermal materials and would love to showcase a wide range of materials varying from the World’s first commercial diamond underfill, to a high filler-load underfill that can flow into small gaps at room temperature, a solder joint encapsulant paste that has low temperature reflow and high pull strength at high temperature (300℃), a reflowable (filled) underfill that is excellent for applications with a narrow footprint and lastly, a mold underfill with a 90% filler load able to flow into 25μm gap without external force.
These are the materials you need and YINCAE Advanced Materials, LLC hopes that you are finalizing preparation for the SEMICON WEST 2018. We are looking forward to seeing you in the Moscone Center at booth 5269 and will be available to talk about our products and answer any inquiries you may have. We hope that you will join us at the conference to learn about our exclusive products that no other company offers. We look forward to seeing you at booth 5269!

UnderfillTreePoster3

SEMICON WEST 2018 is 2 WEEKS AWAY! VISIT YINCAE BOOTH 5269

(Albany, NY) June 27, 2018 – SEMICON West 2018, North America’s premier Microelectronics event, is less than two weeks away! The show will be held at the Moscone Center in San Francisco, CA from July 10th to 12th. YINCAE sincerely invites you to stop by our Booth #5269 to speak with our experts and to see what’s new.

We are noticing an emerging trend in underfill and thermal materials and would love to showcase a wide range of materials varying from the World’s first commercial diamond underfill, to a high filler-load underfill that can flow into small gaps at room temperature, a solder joint encapsulant paste that has low temperature reflow and high pull strength at high temperature (300℃), a reflowable (filled) underfill that is excellent for applications with a narrow footprint and lastly, a mold underfill with a 90% filler load able to flow into 25μm gap without external force.

These are the materials you need and YINCAE Advanced Materials, LLC hopes that you are finalizing preparation for the SEMICON WEST 2018. We are looking forward to seeing you in the Moscone Center at booth 5269 and will be available to talk about our products and answer any inquiries you may have. We hope that you will join us at the conference to learn about our exclusive products that no other company offers. We look forward to seeing you at booth 5269!

If you wish to schedule a booth meeting,
please email us at info@yincae.com or call (518) 452-2880
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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.
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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

 

1 MONTH AWAY FOR SEMICON WEST 2018!!!!

(Albany, NY) 6/12/2018 – SEMICON WEST 2018 is just 1 month away! The tradeshow will take
place at the Moscone Center in San Francisco, California, July 10 to 12. YINCAE hopes you will
stop by our Booth 5269 to learn more about YINCAE and the innovative products we have to
offer.
YINCAE has a wide range of materials varying from the World’s first commercial diamond
underfill, to a high filler-load underfill that have the ability to flow into small gaps at room
temperature, a solder joint encapsulant paste that has low temperature reflow and high pull strength
at high temperature (300℃), a reflowable (filled) underfill that is excellent for micro-bump wafer
level and last but not least, a mold underfill with a 90% filler load able to flow into 25μm gap
without external force.
YINCAE team are eager to reconvene with our longtime clients and to make new connections as
well. The YINCAE staff wants to hear about your latest work and to tell you about ours. In a
consultative approach, our team helps clients identify material and application issues and then
recommend appropriate product solutions.
YINCAE Advanced Materials hopes that you will join us at the conference to learn more. YINCAE
has exclusive products that no other company has developed and can tailor materials to meet your
project needs.
If you would like to schedule a meeting with the YINCAE team, please reach out to us at
info@yincae.com. You can also get more information by visiting our website through the
following link: http://www.yincae.com.
* * * * * * * * * *
Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer
and supplier of high-performance coatings, adhesives and electronic materials used in the microchip &
optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer
level, package level, board level and final devices while facilitating smarter and faster production and supporting
green initiatives.
###
The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.UnderfillTreePoster3

1 MONTH AWAY FOR SEMICON WEST 2018!!!!

(Albany, NY) 6/12/2018 – SEMICON WEST 2018 is just 1 month away! The tradeshow will take
place at the Moscone Center in San Francisco, California, July 10 to 12. YINCAE hopes you will
stop by our Booth 5269 to learn more about YINCAE and the innovative products we have to
offer.
YINCAE has a wide range of materials varying from the World’s first commercial diamond
underfill, to a high filler-load underfill that have the ability to flow into small gaps at room
temperature, a solder joint encapsulant paste that has low temperature reflow and high pull strength
at high temperature (300℃), a reflowable (filled) underfill that is excellent for micro-bump wafer
level and last but not least, a mold underfill with a 90% filler load able to flow into 25μm gap
without external force.
YINCAE team are eager to reconvene with our longtime clients and to make new connections as
well. The YINCAE staff wants to hear about your latest work and to tell you about ours. In a
consultative approach, our team helps clients identify material and application issues and then
recommend appropriate product solutions.
YINCAE Advanced Materials hopes that you will join us at the conference to learn more. YINCAE
has exclusive products that no other company has developed and can tailor materials to meet your
project needs.
If you would like to schedule a meeting with the YINCAE team, please reach out to us at
info@yincae.com. You can also get more information by visiting our website through the
following link: http://www.yincae.com.
* * * * * * * * * *
Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer
and supplier of high-performance coatings, adhesives and electronic materials used in the microchip &
optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer
level, package level, board level and final devices while facilitating smarter and faster production and supporting
green initiatives.
###
The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.UnderfillTreePoster3

SEMICON WEST 2018; 5 reasons to visit YINCAE booth 5269!:

We hope to see you at SEMICON West 2018 this year! YINCAE will be exhibiting at booth #5269 in the north hall of the Moscone Center, and would like to invite you to discuss your latest work and our latest innovations, including…

· World’s first commercial diamond underfill: SMT 158D series.
· High filler-load underfill; flows into small gaps at room temperature: SMT 158UL series.
· Solder joint encapsulant paste; low temperature reflow and high pull strength at high temperature (300℃): SMT 256EP.
· Reflowable (filled) underfill; excellent for micro-bump wafer-level application: SMT 158R and 160 series.
· Mold underfill; 90% filler load, able to flow into 25μm gap: MUF 158 series.

If you would like to learn more about these products, please let us know your availability for a booth meeting with us at SEMICON WEST. We are also available for on-site meetings or WebEx conference calls if you will not be attending this year’s show visit YINCAE.com!SEMIWEST_1MONTH_PR