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IPC APEX 2018 is 2 months away! Visit YINCAE at Booth 2732

(Albany, NY) 12/04/2017 – IPC APEX EXPO is nearly two months away! The trade show will take place at the San Diego Convention Center, in San Diego, CA, from February 27th to March 1st, 2018. YINCAE hopes you will stop by our booth # 2732, to learn more about YINCAE and the innovative products we have to offer.

YINCAE Advanced Materials offers innovative and premier products including: adhesives, thermal interface materials (TIM1/TIM2), board/package/wafer level materials, and coatings; many of which have been implemented by leading semiconductor manufacturers and Tier 1 microelectronic suppliers. YINCAE continues to exceed customer expectations and develop solutions for flip chip, CSP, BGA, POP, LGA, and many more applications. YINCAE hopes to see at the exhibition!

To schedule a meeting with the YINCAE team during the exhibition, please email us at: info@yincae.com with a brief description of the meeting topic. You can also find more information by visiting our website at: www.yincae.com

 

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

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FAQ – Underfill Materials

Which underfill materials are designed for board level applications? SMT158

YINCAE SMT 88 series underfills and SMT 158UL

 

Which underfill materials are designed for package level applications?

YINCAE SMT 158 and SMT 158HA series capillary underfills

 

Which underfill materials are designed for wafer level applications?

YINCAE WL 125 series wafer level underfills

 

What are the benefits of YINCAE SMT 158 series underfills?

  1. Nano underfill
  2. Fast cure option
  3. No resin bleeding
  4. Full compatibility with lead-free processes
  5. Good for narrow gap underfilling
  6. High reliability

 

What are the benefits of YINCAE SMT 88 series underfills?

  1. Room temperature underfilling
  2. Fast flow
  3. Fast low temperature cure
  4. High reliability
  5. Friendly storage conditions
  6. Easy rework

 

Does YINCAE offer thermally conductive underfill materials?

Yes, YINCAE offers three thermally conductive underfill materials

  1. SMT 158A
  2. SMT 158D – Diamond filled
  3. SMT 158FB7

 

   

Does YINCAE offer underfills designed for specific applications (i.e. thermal management, capillary, non-flow…)?

Yes, YINCAE offers a wide range of underfills including:

 

  1. Board level capillary underfill
  2. Package level capillary underfill
  3. Non-flow underfill
  4. Reflowable underfill
  5. Thermal underfill

 

 

Does YINCAE offer underfills with a wide range of options (C.T.E, color, viscosity…)?

Yes, contact us with material requirements and we can send product information.

 

Does YINCAE offer permanent underfills?

Yes, our SMT 158 and SMT 158HA series underfills are permanent

 

Does YINCAE offer reworkable underfills?

Yes, our SMT 88 series underfills and SMT 158UL, are reworkable

 

Is more information (i.e. TDS, additional material options, brochures…) regarding YINCAE underfill materials available?

Yes, please contact us using one of the links provided below. We also have a brochure available on our website.

 

Contact us for general questions

Contact us for technical inquiries

FAQ – Die Attach Adhesives

Which die attach materials can be cured at low temperatures? DA90

YINCAE DA 90 series die attach adhesives

 

Which die attach materials can be cured quick?

Many YINCAE DA 150 series die attach adhesives cure within 15 minutes.

 

Does YINCAE provide both conductive and insulating die attach material options?

Yes, the DA 90 and DA 150 series consist of both insulating and conductive die attach materials.

 

What are the benefits of the DA 90 and DA 150 series die attach adhesives?

  1. Low temperature cure option
  2. Low temperature cure for high temperature applications (400°C)
  3. Low induced stresses
  4. Excellent mechanical resistance
  5. High reliability
  6. High temperature reflow

 

What are the YINCAE TM series products?

TM series products are highly conductive solderable adhesives and can replace conductive adhesives, such as silver paste, or solder materials.

 

What are the benefits of YINCAE TM series products?

  1. Higher thermal conductivity compared to pure solder alloy
  2. Lower process temperatures and high application temperatures
  3. Eliminates outgassing issues
  4. Eliminates cleaning processes
  5. Self-filling and Self-leveling
  6. Withstands harsh environments

 

Are the products shown on your die attach tree the only materials available in this category?

We have many more options. The products shown on the tree are our most popular materials. Please contact us if you are looking for a material with specific properties.

We also have a brochure with additional information regarding our die attach materials available on our website.

 

Is more information (i.e. TDS, additional material options, brochures…) regarding YINCAE die attach materials available?

Yes, please contact us using one of the links provided below. We also have a brochure available on our website.

 

Contact us for general questions

Contact us for technical inquiries

FAQ – Solder Joint Encapsulants

bp256

What are solder joint encapsulant adhesives?

YINCAE solder joint encapsulant adhesives are epoxy based materials with a built-in flux function.

During reflow, solder joint encapsulant adhesives remove oxides allowing the solder joint to form, and encapsulate the solder joint in a 3D polymer network.

 

What are the benefits of solder joint encapsulant adhesives?

  1. Enhance solder joint strength
  2. Improve device reliability
  3. Eliminate underfill and the underfilling process
  4. Eliminate electrical issues (dendrites, electro-migration…)
  5. Eliminates cleaning processes
  6. Lower costs

 

How can solder joint encapsulant adhesives lower costs?

  1. 100 % reworkable – eliminate scrap cost
  2. Air reflowable – eliminate nitrogen cost
  3. Lower material usage
  4. Short manufacturing process – See comparison below
  5. High process yield

 

Underfill Process

underfill process

 

Solder Joint Encapsulant Process

SJE Process

 

 

Why is the reliability for solder joint encapsulant adhesives better than underfills?

Eliminate shrinkage factor generated by underfill (gap is filled with air when using solder joint encapsulants) – Less stress improves reliability

 

 

Can solder joint encapsulants help eliminate head – in – pillow issues?

Yes, solder joint encapsulant products provide additional mechanical strength to solder joints to help mitigate the impact of warpage.

 

 

Why can electro-migration issues be eliminated using YINCAE solder joint encapsulants?

Solder joint encapsulants encapsulate the solder joints after reflow to prevent dendrite formation.

 

 

What is BP 256?

BP 256 is a ball bumping adhesives designed to enhance solder joint strength during ball bumping processes

 

Advantages

  1. Increase throughput
  2. Improve reliability
  3. Eliminate additional cleaning steps
  4. Eliminate underfilling process in SMT production
  5. Reduce costs

 

Is there more information BP 256 available?

A brochure specifically for BP 256 with more detailed information and reliability data is located on our website.

 

Is more information (i.e. TDS, additional material options…) for YINCAE solder joint encapsulant products available?

Yes, please contact us using one the links provided below.

 

Contact us for general questions

Contact us for technical inquiries

IMAPS 2017-Raleigh 2 weeks away, visit YINCAE Booth 416

(Albany, NY) 25 September 2017 –  50th International Symposium on Microelectronics (IMAPS 2017) is 2 weeks away! The trade show will take place at Raleigh Convention Center in Raleigh, North Carolina, on October 10th and 11th. YINCAE hopes you stop at our booth 416 to learn more about YINCAE and the innovative products we have to offer.

Dr. Wusheng Yin, YINCAE Advanced Materials, LLC. will be presenting his latest white paper, “High Reliability and High Throughput Ball Bumping Process Solution – Solder Joint Encapsulant Adhesive” during the CPI Session TP1 Materials and Reliability I at 2:30 pm on Tuesday, October 10, 2017.  As pitch and solder ball size continue to shrink, reliability begins to decline rapidly.  Currently, the industry has adapted traditional; methods such as capillary underfilling and corner or edge bonding. However, as miniaturization continues, even these methods are creating a bottleneck.

YINCAE has developed solder joint encapsulants adhesives for ball bumping applications to eliminate this bottlenecking and allow miniaturization to continue while improving reliability, thermal cycling performance, drop test performance, and mechanical strength.

 

If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

 

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 Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

FAQ – Wafer Level Materials

WL66OWhat underfill materials can be used for wafer level applications?

YINCAE WL 125 series wafer level underfills

 

What die attach adhesive materials can be used for wafer level applications?

YINCAE WL 66H is designed for wafer level die attach applications

 

 

Does YINCAE offer wafer level lens or optical lens attachment materials?

Yes, YINCAE offers WL 66C, WL 66L, and WL 66O

 

 

Are the WL 66 C / L / O materials thermal or UV curable?

Both, these products are generally cured using UV for fast fixing purposes and then thermally cured for high reliability.

 

 

What are the advantages of YINCAE wafer level lens and optical lens attachment materials?

  1. High throughput and process yield
  2. High reliability
  3. Non – Yellowing

 

 

What is WTA 60 used for?

WTA 60 is a temporary bonding adhesive designed for thin wafer protection. WTA 60 prevents damage to wafers during standard semiconductor equipment processing. It is removed using YINCEA WTR 50.

 

 

What is WCP 45 used for?

 

WCP 45 is an aqueous polymer coating designed to protect wafers during laser dicing, drilling, and grooving procedures. It can easily be removed using D.I. water at room temperature.

 

 

What is ACP 120 used for?

ACP 120 is a nano film designed as a low-cost alternative to gold coatings currently used on pins.

 

 

Does YINCAE offer a conductive wafer level adhesive?

Yes, ACP 158 is an anisotropic conductive adhesive designed for wafer level applications.

 

 

There are four products in the WL 66 Series, what are the differences?

WL 66 C / L / O all have different viscosities and are intended for the same purpose: wafer level lens and optical lens attachment materials. WL 66H is designed for wafer level die attach applications

 

 

Are the products shown on your wafer level tree the only materials available in this category?

We have many more options. The products shown on the tree are our most popular materials. Please contact us if you are looking for a material with specific properties.

 

 

Is more information (i.e. TDS, additional material options, brochures…) regarding YINCAE wafer level materials available?

Yes, please contact us using one of the links provided below.

Contact us for general questions

Contact us for technical inquiries

 

Need Enhanced Reliability with Coating Materials?

YINCAE ACP 120 Anti-Oxidation Solderable Coating

ACP120

ACP 120 series are an anti-oxidation solderable coatings, which have been designed for anti-corrosion and rusting for metal surfaces such as nickel, steel, aluminum and other metals; solderable surfaces on which solder paste, solder preform or solder ball can be soldered. ACP 120 can be applied using dipping, immersion or spray method. After a metal is coated with ACP 120 solution, the coated metal surface can be dried at room temperature. The dried coating can be easily reworked using methylethyl ketone to remove, and the cleaned surface can be re-coated using ACP 120.