Press Release SEMICON West is 3 months away! Visit YINCAE at Booth #5269

(Albany, NY) 3/30/2018 –  SEMICON West is nearly 3 months away! The tradeshow will take place at the Moscone Center, in San Francisco, CA, from July 10 thru 12, 2018. YINCAE hopes you will stop by our booth #5269, to learn more about YINCAE and the innovative products we have to offer.

YINCAE offers a variety of exclusive materials such as thermal interface and chip/board/packaging level material, die attach adhesives and underfill that have been adopted by leading contract manufacturers and tier 1 microelectronic suppliers, and we are excited to be showcasing some or our most popular products at SEMICON West.  YINCAE innovated the world’s first lead-free solder joint encapsulation adhesive solution for wafer level, flip chip, POP, LGA, BGA and many other applications.  YINCAE offers SJEA for low, medium and high temperature solder alloy applications for your unique applications.

To schedule a meeting with the YINCAE team during the exhibition, please email us at: sales518@yincae.com with a brief description of the meeting topic. You can also find more information about our products by visiting our website at: www.yincae.com

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

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YINCAE at IPC APEX 2018

What a great Show!  Many thanks to the crew at IPC, and the San Diego Convention Center workers who worked hard to make this the 2018 show a HUGE Success!

As for YINCAE,

All we can say is….WOW!!  Tons of Booth Traffic and lots of exciting opportunities on the horizon for YINCAE.

For those of you who didn’t get a chance to stop by and learn about our Innovative and Industry Leading Technology, Visit our website at http://www.yincae.com.

If you have questions for us, or would like some information on our products, please send an email to info@yincae.com and we will get right back to you…We Promise!!

IPC APEX Group Pic 2

 

 

 

 

Press Release: YINCAE’S New High Purity Liquid Encapsulant: SMT 158HA

Press Release

YINCAE’S New High Purity Liquid Encapsulant: SMT 158HA

(Albany, NY) February 14, 2018 – YINCAE Advanced Materials has recently developed a unique amine based high purity liquid epoxy encapsulant: SMT 158HA. SMT 158HA is a slow cure underfill particularly designed for large components with small bumps and for applications with strict environmental regulations.

SMT 158HA has been particularly designed to be used for large component applications as it is highly viscous and allows air to easily escape from the gap during the underfilling process. The slow cure process allows air bubbles to migrate to the edge and escape. Though these processes generally do not significantly impact most components, they require more time to complete for large chips, and the design of SMT 158HA creates the conditions to lead to a void free underfill. As a result, components will exhibit lower thermal stress, and thus improved reliability for devices.

In additional to numerous processing benefits, SMT 158HA also offers many material benefits. SMT 158HA has a low CTE (20 ppm/K), a high glass transition temperature (156°C), is fast flowing, and offers a high adhesion strength.

For more information on YINCAE’s SMT 158HA underfill, or to learn more about what YINCAE offers, please email us at: info@yincae.com. You can also find more information by visiting our website at: http://www.yincae.com

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.
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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.