High Reliability & High Throughput Ball Bumping Process Solution – Solder Joint Encapsulant Adhesive
(Albany, NY) August 14, 2017 – Dr. Wusheng Yin, YINCAE Advanced Materials LLC, will be discussing a new technology – solder joint encapsulant adhesives for ball bumping, at the 2017 International Symposium on Microelectronics in Raleigh, NC. Thursday, October 12, 2017, as a potential solution to the current limitations and challenges presented by miniaturization. As pitch and solder ball size continue to shrink, reliability begins to decline rapidly. Currently, the industry has adapted traditional methods such as capillary underfilling and corner or edge bonding. However, as miniaturization continues, even these methods are creating a bottleneck.
YINCAE has developed solder joint encapsulant adhesives for ball bumping applications to eliminate this bottleneck and allow miniaturization to continue while improving reliability, thermal cycling performance, drop test performance, and mechanical strength.
We welcome you to attend this speaker presentation on Thursday, October 12, 2017, and stop by our booth, 416, at iMAPS.
Additional information regarding Dr. Yin’s speaking session is available by contacting YINCAE at email@example.com.
If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.