new product

YINCAE’S SMT 158A Receives High Praise

As chips and packages become more complex, and installed in harsher conditions such as automobiles, the thermal conductivity of underfill materials becomes a greater concern. What can be done to prevent decreased reliability due to thermal dissipation issues?

The solution: SMT 158A.

SMT 158A has a thermal conductivity of 2 W/mK, at least four times  that of conventional underfill materials filled with silicon dioxide. As chips and packages become more complex, and are installed in harsh environments, underfill thermal conductivity becomes an important consideration. An underfill with a high thermal conductivity, such as SMT 158A, reduces heat build up and increases chip reliability. SMT 158A was described by a customer as having a thermal conductivity that is “better than any other UF materials from leading UF suppliers”.

SMT 158A is a highly thermally conductive, rapid curing, fast flowing and easily reworked liquid epoxy that can be used for flip chips, chip scale packages, ball grid array devices, package and land grid array applications.  It is also suitable for bare chip protection in a variety of advanced packages such as memory cards, chip carriers, hybrid circuits and multi-chip modules.

SMT 158A has been designed for a high production environment where process speed and mechanical shock are the key concerns.  It is easily dispensed, minimizes induced stresses and provides outstanding reliability performance (e.g., temperature cycling performance) and excellent mechanical resistance.

For more information on YINCAE’s SMT 158A underfill, or to learn more about the YINCAE product range, please email us at: info@yincae.com. You can also find more information by visiting our website at: www.yincae.com

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

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Need Enhanced Reliability with Coating Materials?

YINCAE ACP 120 Anti-Oxidation Solderable Coating

ACP120

ACP 120 series are an anti-oxidation solderable coatings, which have been designed for anti-corrosion and rusting for metal surfaces such as nickel, steel, aluminum and other metals; solderable surfaces on which solder paste, solder preform or solder ball can be soldered. ACP 120 can be applied using dipping, immersion or spray method. After a metal is coated with ACP 120 solution, the coated metal surface can be dried at room temperature. The dried coating can be easily reworked using methylethyl ketone to remove, and the cleaned surface can be re-coated using ACP 120.

PRESS RELEASE: New Product Announcement 

(Albany, NY) January 24, 2017 – BP 256 is YINCAE’s new ball attach adhesive product. BP 256 has been designed to enhance solder joint reliability and eliminate cleaning processes for LEAD-FREE ball bumping procedures on CSP, BGA, Flip chip, and PoP devices. It is compatible with current ball bumping processes. BP 256 is generally applied via printing or pin transfer methods and can replace traditional solder paste, flux, and underfill. During reflow, BP 256 encapsulates individual solder joints improving both reliability and drop test performance. This product also has the benefit of being 100% reworkable. BP 256 is commercially available, is currently being used for ball bumping applications. Additional information on the BP 256 is available by contacting YINCAE at info@yincae.com. If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.