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Need Enhanced Reliability with Coating Materials?

YINCAE ACP 120 Anti-Oxidation Solderable Coating

ACP120

ACP 120 series are an anti-oxidation solderable coatings, which have been designed for anti-corrosion and rusting for metal surfaces such as nickel, steel, aluminum and other metals; solderable surfaces on which solder paste, solder preform or solder ball can be soldered. ACP 120 can be applied using dipping, immersion or spray method. After a metal is coated with ACP 120 solution, the coated metal surface can be dried at room temperature. The dried coating can be easily reworked using methylethyl ketone to remove, and the cleaned surface can be re-coated using ACP 120.

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IPC APEX EXPO is 2 Weeks Away

Press Release

IPC APEX EXPO 2017

VISIT YINCAE Booth # 823

(Albany, NY) 02/03/2016 –  IPC APEX EXPO 2 weeks away! The tradeshow will take place at San Diego Convention Center, in San Diego, CA., February 14-16, 2017. YINCAE hopes you will stop by our booth, to learn more about YINCAE and the innovative products we have to offer.

YINCAE Advanced Materials, LLC hopes that you will join us at the conference to learn about YINCAE and the products that we have to offer. YINCAE has exclusive products that no other company has developed. YINCAE hopes to see you there at the conference. Please visit us at our booth # 823!

YINCAE is to hold a Press Conference at booth #823 on February 14th at 1:30 pm to make major announcement.

If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

 

PRESS RELEASE: New Product Announcement 

(Albany, NY) January 24, 2017 – BP 256 is YINCAE’s new ball attach adhesive product. BP 256 has been designed to enhance solder joint reliability and eliminate cleaning processes for LEAD-FREE ball bumping procedures on CSP, BGA, Flip chip, and PoP devices. It is compatible with current ball bumping processes. BP 256 is generally applied via printing or pin transfer methods and can replace traditional solder paste, flux, and underfill. During reflow, BP 256 encapsulates individual solder joints improving both reliability and drop test performance. This product also has the benefit of being 100% reworkable. BP 256 is commercially available, is currently being used for ball bumping applications. Additional information on the BP 256 is available by contacting YINCAE at info@yincae.com. If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.