Conferences

Press Release SMTA International 2017 – 1 week away – Booth 329

Join Dr. Yin’s Presentation September 20th

 

(Albany, NY) 12 September 2017–  SMTA is fast approaching. SMTA International will take place at the Donald Stephens Convention Center in Rosemont, IL.  September 17-21, 2017. YINCAE is scheduled to exhibit at booth # 329 September 19-20, 2017.

 

Dr. Wusheng Yin, the president of YINCAE Advanced Materials, is scheduled to speak at the technical conference. Dr. Yin will be presenting his white paper, “High Reliability and High Temperature Application Solution – Solder Joint Encapsulant Paste.” The presentation will be on held on Wednesday, September 20 at 9:00am in room 49.

 

YINCAE Advanced Materials, LLC is pioneering the way with their unique solder joint encapsulants, underfill materials, die attach adhesives, wafer lever materials, optoelectronic materials, and conformal coatings.  YINCAE has exclusive products that no other company has developed. The exhibiting YINCAE team hopes to see you at the convention to learn more about the YINCAE brand and the state-of-the-art products offered.

 

To learn more about YINCAE, please visit the YINCAE team at booth # 329.

 

The YINCAE team has begun scheduling booth meetings for SMTAI. If you would like to speak with Dr. Yin or other members of the YINCAE team, please email info@yincae.com.

 

If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

 

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

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High Reliability & High Throughput Ball Bumping Process Solution – Solder Joint Encapsulant Adhesive

Press Release
High Reliability & High Throughput Ball Bumping Process Solution – Solder Joint Encapsulant Adhesive

 (Albany, NY) August 14, 2017 – Dr. Wusheng Yin, YINCAE Advanced Materials LLC, will be discussing a new technology – solder joint encapsulant adhesives for ball bumping, at the 2017 International Symposium on Microelectronics in Raleigh, NC. Thursday, October 12, 2017, as a potential solution to the current limitations and challenges presented by miniaturization. As pitch and solder ball size continue to shrink, reliability begins to decline rapidly. Currently, the industry has adapted traditional methods such as capillary underfilling and corner or edge bonding. However, as miniaturization continues, even these methods are creating a bottleneck.

YINCAE has developed solder joint encapsulant adhesives for ball bumping applications to eliminate this bottleneck and allow miniaturization to continue while improving reliability, thermal cycling performance, drop test performance, and mechanical strength.

We welcome you to attend this speaker presentation on Thursday, October 12, 2017, and stop by our booth, 416, at iMAPS.

Additional information regarding Dr. Yin’s speaking session is available by contacting YINCAE at info@yincae.com.

If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

 

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.
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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

PRESS RELEASE: IPC APEX EXPO is 2 months away.

3d-registered-trademark-logo

 

IPC APEX EXPO 2017

VISIT YINCAE Booth # 823 Located in the NORTH HALL

 

(Albany, NY) 12/07/2016 –  IPC APEX EXPO 2 months away! The tradeshow will take place at San Diego Convention Center, in San Diego, CA., February 14-16, 2017. YINCAE hopes you will stop by our booth, which is in the North Hall, to learn more about YINCAE and the innovative products we have to offer.

 

YINCAE Advanced Materials, LLC hopes that you will join us at the conference to learn about YINCAE and the products that we have to offer. YINCAE has exclusive products that no other company has developed. YINCAE hopes to see you there at the conference. Please visit us at our booth # 823 (North Hall)!

 

If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

 

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

SEMICON West Is Only 2 Weeks Away!

SEMICON West Is Only 2 Weeks Away
VISIT YINCAE AT BOOTH 6448

July 12 – 14, 2016

(Albany, NY) 23 June 2016 – The SEMICON West 2016, North America’s premier Microelectronics event is less than two weeks away! SEMICON West 2016 will be held at the Moscone Center in San Francisco, CA from July 12th to 14th. We sincerely invite you to stop by our Booth 6448 to learn more about YINCAE Advanced Materials.

YINCAE offers a variety of exclusive Adhesives, Thermal Interface, and Chip/Board/Packaging level materials that have been adopted by leading contract manufacturers and Tier 1 Microelectronic suppliers. Recipient of the 2015 Global Technology Award; YINCAE innovated the WORLD’s FIRST Lead-Free Solder Joint Encapsulation Adhesive solutions for wafer level, flip chip, POP, LGA, BGA and many more applications. YINCAE offers SJEA for low, medium, and high temperature solder alloy applications for your individualized needs.

YINCAE Advanced Materials, LLC hopes that you are finalizing preparation for the SEMICON WEST 2016. We are looking forward to seeing you in the North Hall at booth 6448 and will be available to talk about our products and answer any questions that you may have. We hope that you will join us at the conference to learn about YINCAE and the products that we have to offer. We develop exclusive products that no other company can provide. We look forward to seeing you at booth 6448! If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC

CONTACT INFO:

Dr. Wusheng Yin
Phone: (518) 452-2880
E-mail: info@yincae.com